scholarly journals Considerations for an 8-inch Wafer-Level CMOS Compatible AlN Pyroelectric 5–14 μm Wavelength IR Detector Towards Miniature Integrated Photonics Gas Sensors

2020 ◽  
Vol 29 (5) ◽  
pp. 1199-1207 ◽  
Author(s):  
Doris K. T. Ng ◽  
Guoqiang Wu ◽  
Tan-Tan Zhang ◽  
Linfang Xu ◽  
Jianbo Sun ◽  
...  
Keyword(s):  
Gas Sensors ◽  
Integrated Photonics ◽  
Wafer Level ◽  
Ir Detector ◽  
Cmos Compatible

scholarly journals Silicon nitride CMOS-compatible platform for integrated photonics applications at visible wavelengths

2013 ◽  
Vol 21 (12) ◽  
pp. 14036 ◽  
Author(s):  
Sebastian Romero-García ◽  
Florian Merget ◽  
Frank Zhong ◽  
Hod Finkelstein ◽  
Jeremy Witzens
Keyword(s):  
Silicon Nitride ◽  
Integrated Photonics ◽  
Cmos Compatible ◽  
Visible Wavelengths

Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration

2004 ◽  
Vol 812 ◽  
Author(s):  
P. D. Persans ◽  
M. Ojha ◽  
R. J. Gutmann ◽  
J.-Q. Lu ◽  
A. Filin ◽  
...  
Keyword(s):  
Design Optimization ◽  
Optical Waveguides ◽  
Optical Interconnect ◽  
Device Performance ◽  
Wafer Level ◽  
Chip Fabrication ◽  
Cmos Compatible ◽  
Waveguide Fabrication ◽  
Optical Connection

AbstractOptical waveguides for three-dimensionally stacked chip fabrication technologies, in which optical connection between layers plays a central role, are described. CMOS-compatible approaches to optical via and waveguide fabrication are addressed. Detailed modeling is used for design optimization and also addresses how manufacturing variations from ideal design may affect device performance.

Wafer Level Packaging of Micromachined Gas Sensors

2006 ◽  
Vol 6 (5) ◽  
pp. 1232-1235 ◽  
Author(s):  
S. Raible ◽  
D. Briand ◽  
J. Kappler ◽  
N.F. De Rooij
Keyword(s):  
Gas Sensors ◽  
Wafer Level ◽  
Wafer Level Packaging

CMOS Compatible Self-Aligned Micromachined Thermopile IR Detector

2010 ◽  
Vol 30 (10) ◽  
pp. 2817-2820
Author(s):  
徐德辉 Xu Dehui ◽  
熊斌 Xiong Bin ◽  
王跃林 Wang Yuelin
Keyword(s):  
Ir Detector ◽  
Cmos Compatible

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

2012 ◽  
Vol 18 (7-8) ◽  
pp. 1065-1075 ◽  
Author(s):  
Viorel Dragoi ◽  
Eric Pabo ◽  
Jürgen Burggraf ◽  
Gerald Mittendorfer
Keyword(s):  
Wafer Bonding ◽  
Wafer Level ◽  
3D Integration ◽  
Cmos Compatible
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