Comparative Study of Taste Substance Sensing by Liquid Membrane Oscillator and Electrochemical Systems With All-Solid-State Electrodes

2017 ◽  
Vol 17 (17) ◽  
pp. 5735-5740 ◽  
Author(s):  
Maria Szpakowska ◽  
Ewa Marjanska ◽  
Otto B. Naggy
Keyword(s):  
Solid State ◽  
Comparative Study ◽  
Liquid Membrane ◽  
Electrochemical Systems ◽  
Membrane Oscillator

Stand-Alone Semi-Solid-State Electrochemical Systems Based on Bicontinuous Microemulsion Gel Films

2020 ◽  
Vol 92 (20) ◽  
pp. 14031-14037
Author(s):  
Hinako Hashimoto ◽  
Kyosei Goto ◽  
Kouhei Sakata ◽  
Satoshi Watanabe ◽  
Tomoyuki Kamata ◽  
...  
Keyword(s):  
Solid State ◽  
Electrochemical Systems ◽  
Bicontinuous Microemulsion ◽  
Semi Solid ◽  
Microemulsion Gel

Europium (III) complexes with new N-donor ligand: A comparative study in solid state and solution

Polyhedron ◽  
2013 ◽  
Vol 57 ◽  
pp. 30-38 ◽  
Author(s):  
Fabio Piccinelli ◽  
Andrea Melchior ◽  
Adolfo Speghini ◽  
Magda Monari ◽  
Marilena Tolazzi ◽  
...  
Keyword(s):  
Solid State ◽  
Comparative Study ◽  
Donor Ligand

A comparative study of the conformational mobility of octamethyltetrasiloxane and cyclododecane in the solid state

1984 ◽  
Vol 12 (6) ◽  
pp. 557-563 ◽  
Author(s):  
Detlef Emeis ◽  
Hans-Joachim Cantow ◽  
Martin M�ller
Keyword(s):  
Solid State ◽  
Comparative Study ◽  
Conformational Mobility

A Comparative Study for the Backside Illumination (BSI) Technology Using Bonding Wafer Cleaning Process for Advanced CMOS Image Sensor

2012 ◽  
Vol 195 ◽  
pp. 75-78
Author(s):  
Chung Kyung Jung ◽  
Sung Wook Joo ◽  
Seoung Hun Jeong ◽  
Sang Wook Ryu ◽  
Han Choon Lee ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Comparative Study ◽  
Quantum Efficiency ◽  
Wafer Bonding ◽  
Image Sensor ◽  
Silicon On Insulator ◽  
Cleaning Process ◽  
Electrochemical Systems ◽  
Wafer Cleaning ◽  
Direct Wafer Bonding

Over the last decades, the concept of backside illumination (BSI) sensors has become one of the leading solutions to optical challenges such as improved quantum efficiency (QE), and cross-talk, respectively [1-. Direct wafer bonding is a method for fabricating advanced substrates for micro-electrochemical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer.

Comparative study of electrochemical performance of commercial solid-state thin film Li microbatteries

2018 ◽  
Vol 649 ◽  
pp. 69-74 ◽  
Author(s):  
Barbara Laïk ◽  
Isabelle Ressejac ◽  
Cécile Venet ◽  
Jean-Pierre Pereira-Ramos
Keyword(s):  
Thin Film ◽  
Solid State ◽  
Comparative Study ◽  
Electrochemical Performance

Technology for Formation of Hybrid Microfluidic Biosensor Systems for Label-Free Fluorimetric Express Detection of Protein Structures based on Molecular Recognition

2021 ◽  
Vol 23 (6) ◽  
pp. 300-306
Author(s):  
N.O. Sitkov ◽  
◽  
T.M. Zimina ◽  
V.V. Luchinin ◽  
A.A. Kolobov ◽  
...  
Keyword(s):  
Solid State ◽  
Comparative Study ◽  
Chemical Modification ◽  
Protein Structures ◽  
Microfluidic Channels ◽  
Label Free ◽  
Biomedical Analysis ◽  
Surface Deposition ◽  
Working Surface ◽  
Microfluidic Biosensor

The development and comparative study of technologies for manufacturing elements of hybrid biosensor systems intended for express biomedical analysis has been carried out. The technological process included the formation of the relief of microfluidic channels, chemical modification of their working surface, deposition of solid-state phosphor layers, sealing of the system, installation of inlet ports and packaging.

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