All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

This paper presents an all-SiC fiber-optic Fabry-Perot (FP) pressure sensor based on the hydrophilic direct bonding technology for the applications in the harsh environment. The operating principle, fabrication, interface characteristics, and pressure response test of the proposed all-SiC pressure sensor are discussed. The FP cavity is formed by hermetically direct bonding of two-layer SiC wafers, including a thinned SiC diaphragm and a SiC wafer with an etched cavity. White light interference is used for the detection and demodulation of the sensor pressure signals. Experimental results demonstrate the sensing capabilities for the pressure range up to 800 kPa. The all-SiC structure without any intermediate layer can avoid the sensor failure caused by the thermal expansion coefficient mismatch and therefore has a great potential for pressure measurement in high temperature environments.

GaAs to Si Direct Wafer Bonding at T ≤ 220°C in Ambient Air via Nano-BondingTM and Surface Energy Engineering (SEE)

When different semiconductors are integrated into hetero-junctions, native oxides generate interfacial defects and cause electronic recombination. Two state-of-the-art integration methods, hetero-epitaxy and Direct Wafer Bonding (DWB), require temperatures > 400°C to reduce native oxides. However, T > 400°C leads to defects due to lattice and thermal expansion mismatches. In this work, DWB temperatures are lowered via Nano-Bonding™ (NB) at T ≤ 220°C and P ≤ 60 kPa (9 psi). NB uses Surface Energy Engineering (SEE) at 300K to modify surface energies (γT) to far-from-equilibrium states, so cross-bonding occurs with little thermal activation and compression. SEE modifies γT and hydro-affinity (HA) via chemical etching, planarization, and termination that are optimized to yield 2-D Precursor Phases (2D-PP) metastable in ambient air and highly planar at the nano- and micro- scales. Complementary 2D-PPs nano-contact via carrier exchange from donor 2D-PP surfaces to acceptor ones. Here, NB models and SEE are applied to the DWB of GaAs to Si for photo-voltaics. SEE modifies (1) the initial γT0 and HA0 measured via Three Liquid Contact Angle Analysis, (2) the oxygen coverage measured via High Resolution Ion Beam Analysis, and (3) the oxidation states measured via X-Ray Photoelectron Spectroscopy. SEE etches hydrophobic GaAs oxides with γT = 33.4 ± 1 mJ/m2, and terminates GaAs (100) with H+, rendering GaAs hydrophilic with γT = 60 ± 2 mJ/m2. Similarly, hydrophilic Si native oxides are etched into hydrophobic SiO4H2. H+- GaAs nano-bonds reproducibly to Si, as measured via Surface Acoustic Wave Microscopy, validating the NB model and SEE design.