A Comparative Study for the Backside Illumination (BSI) Technology Using Bonding Wafer Cleaning Process for Advanced CMOS Image Sensor
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Over the last decades, the concept of backside illumination (BSI) sensors has become one of the leading solutions to optical challenges such as improved quantum efficiency (QE), and cross-talk, respectively [1-. Direct wafer bonding is a method for fabricating advanced substrates for micro-electrochemical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer.
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1991 ◽
Vol 138
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pp. 2468-2474
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1992 ◽
Vol 15
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pp. 156-159
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1995 ◽
Vol 53
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pp. 460-461
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2006 ◽
Vol 45
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pp. 8717-8718
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