Passive Alignment and Mounting of LiNbO$_3$ Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au

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Eiji Higurashi ◽  
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Author(s):  
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Penghui Xu ◽  
Wenqi Zhang ◽  
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pp. P7-P10 ◽  
Author(s):  
Z. Chen ◽  
T. Luo ◽  
T. Hang ◽  
M. Li ◽  
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Vol 64 (6) ◽  
pp. 772-774 ◽  
Author(s):  
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H. Morkoç ◽  
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