2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Latest Publications

TOTAL DOCUMENTS

131

(FIVE YEARS 131)

H-INDEX

(FIVE YEARS 1)

Published By IEEE

9781728162935

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Highly Integrated Assembly Processes Solutions for Double-Sided-SiP Package

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229680 ◽

2020 ◽

Author(s):

Bo-Hao Ma ◽

David Ho ◽

Yu-Po Wang ◽

Freedman Yen ◽

Shawn Guo ◽

...

Download Full-text

Thermal and Electro-Thermal Analysis of DC-DC convertor for 3 wheeler electric vehicle

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229677 ◽

2020 ◽

Author(s):

Ritwik Alok Pattnayak ◽

Bhushan Manapadam Baskar

Keyword(s):

Thermal Analysis ◽

Electric Vehicle

Download Full-text

Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229743 ◽

2020 ◽

Author(s):

Iuliana Panchenko ◽

Laura Wambera ◽

Maik Mueller ◽

Catharina Rudolph ◽

Anke Hanisch ◽

...

Keyword(s):

Structure Analysis ◽

Grain Structure ◽

Reliability Testing

Download Full-text

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229720 ◽

2020 ◽

Author(s):

Jakob Schober ◽

Johannes Berger ◽

Constanze Eulenkamp ◽

Karl Nicolaus ◽

Gregor Feiertag

Keyword(s):

Acoustic Wave ◽

Thick Film ◽

Surface Acoustic Wave ◽

Wafer Level

Download Full-text

Dry-electrode based ECG monitoring device with electrodes reliability test capabilities

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229866 ◽

2020 ◽

Author(s):

Stefan-Cristian Voica ◽

Andrei Dragulinescu ◽

Ana-Maria Dragulinescu

Keyword(s):

Reliability Test ◽

Monitoring Device ◽

Ecg Monitoring ◽

Dry Electrode

Download Full-text

All Printed Flexible Piezoelectric Pressure Sensor with Interdigitated Electrodes

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229777 ◽

2020 ◽

Author(s):

Karem Lozano Montero ◽

Mika-Matti Laurila ◽

Matti Mantysalo

Keyword(s):

Pressure Sensor ◽

Interdigitated Electrodes ◽

Piezoelectric Pressure Sensor

Download Full-text

Carbon nanotubes based on-chip supercapacitors with improved areal energy density

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229835 ◽

2020 ◽

Author(s):

Chengjun Yu ◽

Xuyuan Chen

Keyword(s):

Carbon Nanotubes ◽

Energy Density ◽

On Chip

Download Full-text

Post-Binary Robotics: Using Memristors With Ternary States for Robotics Control

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229820 ◽

2020 ◽

Author(s):

Steven Bos ◽

Julian Breivold Nilsen ◽

Henning Gundersen

Download Full-text

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229700 ◽

2020 ◽

Author(s):

Alexander Klemm ◽

Michael Schmidt ◽

Martin Rittner ◽

Michael Guyenot ◽

Manfred Reinold ◽

...

Keyword(s):

Temperature Cycling ◽

Power Modules ◽

Inductive Power

Download Full-text

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229850 ◽

2020 ◽

Author(s):

Chuantong Chen ◽

Zheng Zhang ◽

Katsuaki Suganuma

Keyword(s):

High Temperature ◽

Ag Particles ◽

Micron Size

Download Full-text

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Highly Integrated Assembly Processes Solutions for Double-Sided-SiP Package

Thermal and Electro-Thermal Analysis of DC-DC convertor for 3 wheeler electric vehicle

Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages

Dry-electrode based ECG monitoring device with electrodes reliability test capabilities

All Printed Flexible Piezoelectric Pressure Sensor with Interdigitated Electrodes

Carbon nanotubes based on-chip supercapacitors with improved areal energy density

Post-Binary Robotics: Using Memristors With Ternary States for Robotics Control

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Latest Publications