2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
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9781728162935
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages

2020 ◽  
Author(s):  
Jakob Schober ◽  
Johannes Berger ◽  
Constanze Eulenkamp ◽  
Karl Nicolaus ◽  
Gregor Feiertag
Keyword(s):  
Acoustic Wave ◽  
Thick Film ◽  
Surface Acoustic Wave ◽  
Wafer Level

Dry-electrode based ECG monitoring device with electrodes reliability test capabilities

2020 ◽  
Author(s):  
Stefan-Cristian Voica ◽  
Andrei Dragulinescu ◽  
Ana-Maria Dragulinescu
Keyword(s):  
Reliability Test ◽  
Monitoring Device ◽  
Ecg Monitoring ◽  
Dry Electrode

Post-Binary Robotics: Using Memristors With Ternary States for Robotics Control

2020 ◽  
Author(s):  
Steven Bos ◽  
Julian Breivold Nilsen ◽  
Henning Gundersen

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

2020 ◽  
Author(s):  
Alexander Klemm ◽  
Michael Schmidt ◽  
Martin Rittner ◽  
Michael Guyenot ◽  
Manfred Reinold ◽  
...  
Keyword(s):  
Temperature Cycling ◽  
Power Modules ◽  
Inductive Power

Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation

2020 ◽  
Author(s):  
Rainer Dudek ◽  
Anu Mathew ◽  
Jan Albrecht ◽  
Christina Scherf ◽  
Sven Rzepka ◽  
...  
Keyword(s):  
Wire Bonding ◽  
Nano Indentation ◽  
Reliability Modelling

Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications

2020 ◽  
Author(s):  
Stoyan Stoyanov ◽  
Chris Bailey ◽  
Paul Stewart ◽  
Graeme Morrison
Keyword(s):  
High Reliability
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