2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Latest Publications

TOTAL DOCUMENTS

131

(FIVE YEARS 131)

H-INDEX

(FIVE YEARS 1)

Published By IEEE

9781728162935

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229720 ◽

2020 ◽

Author(s):

Jakob Schober ◽

Johannes Berger ◽

Constanze Eulenkamp ◽

Karl Nicolaus ◽

Gregor Feiertag

Keyword(s):

Acoustic Wave ◽

Thick Film ◽

Surface Acoustic Wave ◽

Wafer Level

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Dry-electrode based ECG monitoring device with electrodes reliability test capabilities

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229866 ◽

2020 ◽

Author(s):

Stefan-Cristian Voica ◽

Andrei Dragulinescu ◽

Ana-Maria Dragulinescu

Keyword(s):

Reliability Test ◽

Monitoring Device ◽

Ecg Monitoring ◽

Dry Electrode

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All Printed Flexible Piezoelectric Pressure Sensor with Interdigitated Electrodes

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229777 ◽

2020 ◽

Author(s):

Karem Lozano Montero ◽

Mika-Matti Laurila ◽

Matti Mantysalo

Keyword(s):

Pressure Sensor ◽

Interdigitated Electrodes ◽

Piezoelectric Pressure Sensor

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Carbon nanotubes based on-chip supercapacitors with improved areal energy density

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229835 ◽

2020 ◽

Author(s):

Chengjun Yu ◽

Xuyuan Chen

Keyword(s):

Carbon Nanotubes ◽

Energy Density ◽

On Chip

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Post-Binary Robotics: Using Memristors With Ternary States for Robotics Control

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229820 ◽

2020 ◽

Author(s):

Steven Bos ◽

Julian Breivold Nilsen ◽

Henning Gundersen

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Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229700 ◽

2020 ◽

Author(s):

Alexander Klemm ◽

Michael Schmidt ◽

Martin Rittner ◽

Michael Guyenot ◽

Manfred Reinold ◽

...

Keyword(s):

Temperature Cycling ◽

Power Modules ◽

Inductive Power

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Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229850 ◽

2020 ◽

Author(s):

Chuantong Chen ◽

Zheng Zhang ◽

Katsuaki Suganuma

Keyword(s):

High Temperature ◽

Ag Particles ◽

Micron Size

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An Organic Process Design Kit, from characterization to modelling and simulation

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229883 ◽

2020 ◽

Author(s):

August Arnal ◽

Lluis Teres ◽

Eloi Ramon

Keyword(s):

Process Design ◽

Modelling And Simulation ◽

Organic Process

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Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229761 ◽

2020 ◽

Author(s):

Rainer Dudek ◽

Anu Mathew ◽

Jan Albrecht ◽

Christina Scherf ◽

Sven Rzepka ◽

...

Keyword(s):

Wire Bonding ◽

Nano Indentation ◽

Reliability Modelling

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Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229828 ◽

2020 ◽

Author(s):

Stoyan Stoyanov ◽

Chris Bailey ◽

Paul Stewart ◽

Graeme Morrison

Keyword(s):

High Reliability

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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages

Dry-electrode based ECG monitoring device with electrodes reliability test capabilities

All Printed Flexible Piezoelectric Pressure Sensor with Interdigitated Electrodes

Carbon nanotubes based on-chip supercapacitors with improved areal energy density

Post-Binary Robotics: Using Memristors With Ternary States for Robotics Control

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

An Organic Process Design Kit, from characterization to modelling and simulation

Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation

Reliability Impact of Assembly Materials for Micro-BGA Components in High Reliability Applications

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
Latest Publications