Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Low temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, process analyses and shear strength studies of paste-based approaches to LT-TLPS are presented. The process progression studies include DSC analyses and observations of intermetallic compound (IMC) formation by cross-sectioning. It was found that the sintering process reaches completion after sintering times of 15 min for process temperatures approximately 50°C above the melting point of the low temperature constituent. For the shear studies, test samples consisting of copper dice and copper substrates joined by sintering with a variety of sinter pastes with different ratios of copper and tin have been assessed. A fixture was designed for high temperature enabled shear tests at 25°C, 125°C, 250°C, 400°C, and 600°C. The influence of the ratio of the amount of high melting-point constituent to the amount of low melting-point constituent on the maximum application temperature of the sinter paste was analyzed. Ag20Sn and Cu50Sn pastes showed no reduction in shear strength up to 400°C, and Cu40Sn pastes showed high shear strengths up to 600°C. It was shown that LT-TLPS can be used to form high temperature stable joints at low temperatures without the need to apply pressure during processing.

Download Full-text

Sonochemical synthesis of silver nanoparticles coated copper wire for low-temperature solid state bonding on silicon substrate

Chinese Chemical Letters ◽

10.1016/j.cclet.2019.04.050 ◽

2019 ◽

Vol 30 (7) ◽

pp. 1455-1459

Author(s):

Qiang Hu ◽

Chen Zhao ◽

Zhejuan Zhang ◽

Jun Guo ◽

Chenlu Yu ◽

...

Keyword(s):

Silver Nanoparticles ◽

Solid State ◽

Low Temperature ◽

Silicon Substrate ◽

Copper Wire ◽

Sonochemical Synthesis ◽

Solid State Bonding

Download Full-text

Synthesis of by the Flux Method

ISRN Materials Science ◽

10.5402/2012/170362 ◽

2012 ◽

Vol 2012 ◽

pp. 1-5 ◽

Cited By ~ 7

Author(s):

Yuki Maruyama ◽

Chihiro Izawa ◽

Tomoaki Watanabe

Keyword(s):

High Temperature ◽

Solid State ◽

Low Temperature ◽

Diffuse Reflectance ◽

High Temperature Phase ◽

Temperature Phase ◽

Flux Method ◽

Phase Crystal ◽

Euhedral Crystal ◽

Low Temperature Phase

has been successfully synthesized using Bi2O3–B2O3 eutectic flux. In particular, we succeeded in synthesizing a low-temperature-phase crystal (α-) at 1073 K as well as high-temperature-phase crystal (β-). The morphology of α- and β- particles prepared by the flux method is a euhedral crystal. In contrast, the morphology of particles prepared by solid state reaction differs: α- is aggregated and β- is necked. Ultraviolet-visible diffuse reflectance spectra indicate that the absorption edge is at a longer wavelength for β- than for α- with β- absorbing light of wavelengths up to nearly 400 nm.

Download Full-text

Solid State Bonding of CuCrZr to Duplex Stainless Steel

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.302.136 ◽

2013 ◽

Vol 302 ◽

pp. 136-139 ◽

Cited By ~ 1

Author(s):

Ho Sung Lee ◽

Jong Hoon Yoon ◽

Joon Tae Yoo ◽

Ji Ung Choi

Keyword(s):

Mechanical Properties ◽

Stainless Steel ◽

High Temperature ◽

Solid State ◽

Duplex Stainless Steel ◽

High Strength ◽

Atomic Diffusion ◽

Thermal And Mechanical Properties ◽

Solid State Bonding ◽

Duplex Steel

In the solid state bonding, joint are made by pressing surfaces together at high temperature so that a bond grows across the interface by atomic diffusion. In order to satisfy both requirements of thermal and mechanical properties of aerospace vehicle, conductive CuCrZr alloy was bonded to duplex steel with high strength. Solid state bonding was performed at 3 different pressure conditions and at temperatures of 850°C and 950°C. Microstructural and mechanical evaluation was performed to obtain the optimum joining condition.

Download Full-text

Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

Journal of Materials Science ◽

10.1007/s10853-017-1689-y ◽

2017 ◽

Vol 53 (4) ◽

pp. 2618-2630 ◽

Cited By ~ 4

Author(s):

Jiaqi Wu ◽

Chin C. Lee

Keyword(s):

High Temperature ◽

Solid State ◽

Low Pressure ◽

Fine Grained ◽

High Temperature Electronics ◽

Solid State Bonding ◽

Bonding Technology

Download Full-text

Crystallization Characteristics and Thermal Stability of Fluor-Hydroxyapatite Composites with Zirconia

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.182-183.122 ◽

2012 ◽

Vol 182-183 ◽

pp. 122-125

Author(s):

Li Li Wang ◽

Xiu Feng Wang ◽

Cheng Long Yu ◽

Hong Tao Jiang

Keyword(s):

Thermal Stability ◽

High Temperature ◽

Solid State ◽

Low Temperature ◽

Solid Solutions ◽

Tricalcium Phosphate ◽

Solid State Reaction ◽

Calcium Fluoride ◽

Raw Materials ◽

Thermal Stability Of

Hydroxyapatite (HA) was synthesized in presence of 20wt% m-ZrO2by solid state reaction between tricalcium phosphate(TCP) and Ca(OH)2at 1000 °C for 2h. Similarily, Fluorine hydroxyapatite(FA) was synthesized using tricalcium phosphate and calcium fluoride as raw materials at 1000 °Cfor 3h. The as-prepared HA was mixed with 10%,25%,45%,55%,70wt% FA and the mixture was sintered at 1000°C-1400°C for 2h. The main phase and bulk density was measured. The results show that when the relative amount of FA to HA increased, the decomposition of the composite is decreased gradually because of the formation of thermally stable FHA solid solutions. Low temperature would effect the exchange of ionic between FA and HA,while high temperature would impact synthesis of composites, because high temperature would lead to dissolution of HA ,which has to react with FA. Increase the content of HA would be advantage for synthesis FHA-ZrO2composite.

Download Full-text