Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

2015 ◽  
Vol 36 (7) ◽  
pp. 702-704 ◽  
Author(s):  
Keon Hwa Lee ◽  
Seung Hwan Kim ◽  
Woo-Sik Lim ◽  
June-O Song ◽  
Jae-Hyun Ryou
Keyword(s):  
Thin Film ◽  
Visible Light ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Anisotropic Conductive Film ◽  
Wafer Level ◽  
Light Emitting ◽  
Conductive Film ◽  
Chip Scale Package

Innovative Fabrication of Wafer-Level InGaN-Based Thin-Film Flip-Chip Light-Emitting Diodes

2015 ◽  
Vol 27 (13) ◽  
pp. 1457-1460 ◽  
Author(s):  
Yen-Chih Chiang ◽  
Bing-Cheng Lin ◽  
Kuo-Ju Chen ◽  
Chien-Chung Lin ◽  
Po-Tsung Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Wafer Level ◽  
Light Emitting

scholarly journals Aspect ratio engineering of microlens arrays in thin-film flip-chip light-emitting diodes

2015 ◽  
Vol 54 (34) ◽  
pp. 10299 ◽  
Author(s):  
Peifen Zhu ◽  
Chee-Keong Tan ◽  
Wei Sun ◽  
Nelson Tansu
Keyword(s):  
Thin Film ◽  
Aspect Ratio ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Microlens Arrays ◽  
Light Emitting

Performance of Flip-Chip Thin-Film GaN Light-Emitting Diodes With and Without Patterned Sapphires

2010 ◽  
Vol 22 (8) ◽  
pp. 550-552 ◽  
Author(s):  
Ray-Hua Horng ◽  
Hung-Lieh Hu ◽  
Mu-Tao Chu ◽  
Yu-Li Tsai ◽  
Yao-Jun Tsai ◽  
...  
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting
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