2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

1K channel optical interconnects of CMOS-PQR flip chip

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1320323 ◽

2004 ◽

Author(s):

O'Dae Kwon ◽

Kwonsub Lim ◽

Jungyoun Kim ◽

Sangkyeom Kim ◽

Moojin Kim ◽

...

Keyword(s):

Optical Interconnects ◽

Flip Chip

An opto-electronic hybrid integration platform with a polymer optical waveguide for high performance and low cost modules

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319468 ◽

2004 ◽

Author(s):

T. Shimizu ◽

Y. Akimoto ◽

K. Kurata

Keyword(s):

Optical Waveguide ◽

High Performance ◽

Low Cost ◽

Hybrid Integration ◽

Integration Platform

Process integration of 3D chip stack with vertical interconnection

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319400 ◽

2004 ◽

Cited By ~ 51

Author(s):

K. Takahashi ◽

Y. Taguchi ◽

M. Tomisaka ◽

H. Yonemura ◽

M. Hoshino ◽

...

Keyword(s):

Process Integration ◽

Vertical Interconnection

Modeling of embedded inductor on low cost multilayer laminate MCM technology and its application

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319355 ◽

2004 ◽

Author(s):

R.C. Lee ◽

J. Goodrich ◽

A. Agarwal

Keyword(s):

Low Cost

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319352 ◽

2004 ◽

Cited By ~ 3

Author(s):

D. Balaraman ◽

Jinwoo Choi ◽

V. Patel ◽

P.M. Raj ◽

I.R. Abothu ◽

...

Keyword(s):

Thin Film ◽

Barium Titanate ◽

Noise Suppression ◽

Switching Noise ◽

Thin Film Capacitors ◽

Simultaneous Switching Noise ◽

Simultaneous Switching ◽

Barium Titanate Thin Film ◽

Titanate Thin Film

Modeling and optimization of multilayer LTCC inductors for RF/wireless applications using neural network and genetic algorithms

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319346 ◽

2004 ◽

Cited By ~ 8

Author(s):

R.J. Pratap ◽

S. Sarkar ◽

S. Pinel ◽

J. Laskar ◽

G.S. May

Keyword(s):

Neural Network ◽

Genetic Algorithms ◽

Modeling And Optimization ◽

Wireless Applications ◽

Rf Wireless

Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1320337 ◽

2004 ◽

Author(s):

S. Khan ◽

M. Asaduzzaman ◽

M.A. Lamontia ◽

J.G. Sloan

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Thermal Cycling ◽

Solder Ball ◽

Substrate Material ◽

Printed Wiring Board ◽

Element Analysis ◽

Wiring Board

An efficient full-wave layered interconnect simulator (UA-FWLIS)

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319344 ◽

2004 ◽

Cited By ~ 1

Author(s):

Xing Wang ◽

Zhaohui Zhu ◽

S.L. Dvorak ◽

J.L. Prince

Keyword(s):

Full Wave

Integrated Substrate Technology

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1320271 ◽

2004 ◽

Cited By ~ 5

Author(s):

R. Chanchani ◽

D.T. Bethke ◽

D.B. Webb ◽

C. Sandoval ◽

G. Wouters

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319314 ◽

2004 ◽

Cited By ~ 15

Author(s):

M. Hutter ◽

F. Hohnke ◽

H. Oppermann ◽

M. Klein ◽

G. Engelmann

Keyword(s):

Flip Chip ◽

Solder Joints

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

1K channel optical interconnects of CMOS-PQR flip chip

An opto-electronic hybrid integration platform with a polymer optical waveguide for high performance and low cost modules

Process integration of 3D chip stack with vertical interconnection

Modeling of embedded inductor on low cost multilayer laminate MCM technology and its application

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

Modeling and optimization of multilayer LTCC inductors for RF/wireless applications using neural network and genetic algorithms

Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis

An efficient full-wave layered interconnect simulator (UA-FWLIS)

Integrated Substrate Technology

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

Export Citation Format

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

1K channel optical interconnects of CMOS-PQR flip chip

An opto-electronic hybrid integration platform with a polymer optical waveguide for high performance and low cost modules

Process integration of 3D chip stack with vertical interconnection

Modeling of embedded inductor on low cost multilayer laminate MCM technology and its application

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

Modeling and optimization of multilayer LTCC inductors for RF/wireless applications using neural network and genetic algorithms

Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis

An efficient full-wave layered interconnect simulator (UA-FWLIS)

Integrated Substrate Technology

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
Latest Publications