High-data-rate, high-density magnetic tape recorder using matrix writing head and Kerr reading head

Author(s):  
J.-C. Lehureau ◽  
J.-P. Castera
Frequenz ◽  
2013 ◽  
Vol 67 (7-8) ◽  
Author(s):  
Krisada Prachumrasee ◽  
Arkom Kaewrawang ◽  
Anan Kruesubthaworn ◽  
Roong Sivaratana ◽  
Apirat Siritaratiwat

2002 ◽  
Vol 38 (5) ◽  
pp. 1873-1878 ◽  
Author(s):  
S.W. Yuan ◽  
E. Lee ◽  
W. Hsiao ◽  
H. Santini ◽  
H. Lam ◽  
...  

2015 ◽  
Vol 2015 (1) ◽  
pp. 000616-000620 ◽  
Author(s):  
S. Bernabé ◽  
G. Pares ◽  
B. Blampey ◽  
K. Rida ◽  
O. Castany ◽  
...  

Achieving high data speed (typically Nx25 Gbps) compact optoelectronic modules is now made possible by using Photonic Integrated Circuits (PIC) combined with CMOS electronic drivers. Among the techniques that can be used to combine both circuits, flip-chip assembly based on micro-bumps shows several advantages, for example low RF parasitics and high density compared to wire bonding. Using this technique, it is possible to build low consumption photonic receivers working at 25 Gbps.


1998 ◽  
Author(s):  
Robert Kerczewski ◽  
Duc Ngo ◽  
Diepchi Tran ◽  
Quang Tran ◽  
Brian Kachmar

Author(s):  
John D. Terry ◽  
Juha Heiskala ◽  
Victor Stolpman ◽  
Majid Fozunbal

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