Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
2009 ◽
Vol 19
(12)
◽
pp. 125029
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2010 ◽
Vol 19
(2)
◽
pp. 317-324
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2019 ◽
Vol 30
(23)
◽
pp. 20369-20375
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Keyword(s):
2019 ◽
Vol 3
(7)
◽
pp. 1328-1334
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Keyword(s):