Silicon on diamond heat sinks by bonding and etch back

Proceedings of 1993 IEEE International SOI Conference ◽

10.1109/soi.1993.344593 ◽

2002 ◽

Cited By ~ 2

Author(s):

A. Soderbarg ◽

B. Edholm ◽

J. Olsson ◽

S. Tiensuu ◽

E. Johansson

Keyword(s):

Heat Sinks

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LAMINAR FLOW AND HEAT-TRANSFER CHARACTERISTICS OF MICROCHANNEL HEAT SINKS COMBINED WITH RIBS AND CAVITIES FOR ELECTRONIC COOLING

Computational Thermal Sciences An International Journal ◽

10.1615/computthermalscien.2017021739 ◽

2018 ◽

Vol 10 (2) ◽

pp. 103-119 ◽

Cited By ~ 2

Author(s):

Hong-Ju Guo ◽

Wei-Biao Ye ◽

Si-Min Huang ◽

Shu-Ying Wu ◽

De-Qi Peng

Keyword(s):

Heat Transfer ◽

Laminar Flow ◽

Electronic Cooling ◽

Heat Sinks ◽

Heat Transfer Characteristics ◽

Transfer Characteristics ◽

Flow And Heat Transfer ◽

Microchannel Heat Sinks

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HEAT TRANSFER IN A CHANNEL WITH INTERMITTENT HEATED ALUMINUM-FOAM HEAT SINKS

Heat Transfer Research ◽

10.1615/heattransres.2016008380 ◽

2017 ◽

Vol 48 (3) ◽

pp. 211-220

Author(s):

Ayla Dogan ◽

Bahadir Oney

Keyword(s):

Heat Transfer ◽

Aluminum Foam ◽

Heat Sinks

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BYPASS EFFECT IN HIGH PERFORMANCE HEAT SINKS

Proceedings of the International Thermal Science Seminar Bled. Volume 1 ◽

10.1615/ichmt.2000.thersieprocvol2thersieprocvol1.340 ◽

2000 ◽

Cited By ~ 1

Author(s):

Suzana Prstic ◽

Madhusudan Iyengar ◽

Avram Bar-Cohen

Keyword(s):

High Performance ◽

Heat Sinks

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Experimental Comparison of Thermal Resistance for Micro pin fin heat sinks with different shapes and arrangement

Proceeding of Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019) ◽

10.1615/ihmtc-2019.710 ◽

2019 ◽

Author(s):

Gagan V. Kewalramani ◽

Gaurav Hedau ◽

Sandip Kumar Saha ◽

Amit Agrawal

Keyword(s):

Thermal Resistance ◽

Heat Sinks ◽

Experimental Comparison ◽

Pin Fin ◽

Different Shapes

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HEAT TRANSFER PERFORMANCE EVALUATION OF CORRUGATED MICROCHANNEL HEAT SINKS

10.1615/ihtc16.nmt.022030 ◽

2018 ◽

Author(s):

Ganbat Davaa ◽

O. Jambal

Keyword(s):

Heat Transfer ◽

Performance Evaluation ◽

Heat Transfer Performance ◽

Heat Sinks ◽

Transfer Performance ◽

Microchannel Heat Sinks

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Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks

Proceeding of International Heat Transfer Conference 8 ◽

10.1615/ihtc8.4090 ◽

1986 ◽

Cited By ~ 13

Author(s):

K.-A. Park ◽

Arthur E. Bergles

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Heat Sinks ◽

Heat Transfer Characteristics ◽

Transfer Characteristics

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STUDY OF HEAT TRANSFER CHARACTERISTICS OF PERFORATED CIRCULAR PIN-FIN HEAT SINKS COOLED BY AN INCLINED IMPINGING JET

Journal of Enhanced Heat Transfer ◽

10.1615/jenhheattransf.2019031525 ◽

2019 ◽

Vol 26 (6) ◽

pp. 577-595

Author(s):

Mao-Yu Wen ◽

Ching-Yen Ho

Keyword(s):

Heat Transfer ◽

Impinging Jet ◽

Heat Sinks ◽

Heat Transfer Characteristics ◽

Pin Fin ◽

Transfer Characteristics

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ANALYTICAL AND NUMERICAL STUDY OF RADIATION IN HEAT SINKS OF RECTANGULAR FINS

10.26678/abcm.cobem2019.cob2019-1465 ◽

2019 ◽

Author(s):

Felipe Henrique Rafael ◽

Vilson Silva ◽

Bruno de Campos Salles Anselmo ◽

Sandro Metrevelle Marcondes de Lima e Silva

Keyword(s):

Numerical Study ◽

Heat Sinks

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ANALYSIS OF GEOMETRICAL PARAMETERS IN HEAT SINKS UNDER FREE CONVECTION USING DOE

10.26678/abcm.encit2018.cit18-0729 ◽

2018 ◽

Author(s):

Bruno de Campos Salles Anselmo ◽

Sandro Metrevelle Marcondes de Lima e Silva

Keyword(s):

Free Convection ◽

Heat Sinks ◽

Geometrical Parameters

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A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS

10.26678/abcm.encit2018.cit18-0394 ◽

2018 ◽

Cited By ~ 1

Author(s):

Daniel Borba Marchetto ◽

Debora Carneiro Moreira ◽

Gherhardt Ribatski

Keyword(s):

Electronic Cooling ◽

Heat Sinks

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