A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS

2018 ◽  
Author(s):  
Daniel Borba Marchetto ◽  
Debora Carneiro Moreira ◽  
Gherhardt Ribatski
Keyword(s):  
Electronic Cooling ◽  
Heat Sinks

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Copper foam/PCMs based heat sinks: An experimental study for electronic cooling systems

2018 ◽  
Vol 127 ◽  
pp. 381-393 ◽  
Author(s):  
Tauseef-ur- Rehman ◽  
Hafiz Muhammad Ali ◽  
Ahmed Saieed ◽  
William Pao ◽  
Muzaffar Ali
Keyword(s):  
Experimental Study ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Cooling Systems ◽  
Copper Foam

A Method for Determining the Heat Transfer Properties of Foam-Fins

2008 ◽  
Vol 131 (1) ◽  
Author(s):  
Robert J. Moffat ◽  
John K. Eaton ◽  
Andrew Onstad
Keyword(s):  
Heat Transfer ◽  
Heat Exchangers ◽  
Heat Transfer Performance ◽  
Electronic Cooling ◽  
Test Method ◽  
Heat Sinks ◽  
Compact Heat Exchangers ◽  
Extended Surfaces ◽  
Open Cell Foams ◽  
Transfer Properties

Metallic and graphitic open-cell foams are being used or proposed as extended surfaces (fins) in heat sinks for electronic cooling and compact heat exchangers for aircraft applications. Three parameters must be known to calculate the heat transfer performance of a foam-fin: the product hmAc* as a function of flow-rate (the convective conductance per unit volume), the product ksAk* (the effective conductive conductance as a fin), and Rbond (the effective thermal resistance between the foam and the surface to which it is attached). This paper describes a new test method, which, in conjunction with an older well established type of test, allows all three parameters to be measured using one specimen.

scholarly journals Performance of Shrouded Pin-Fin Heat Sinks for Electronic Cooling

2006 ◽  
Vol 20 (3) ◽  
pp. 408-414 ◽  
Author(s):  
W. A. Khan ◽  
J. R. Culham ◽  
M. M. Yovanovich
Keyword(s):  
Electronic Cooling ◽  
Heat Sinks ◽  
Pin Fin

scholarly journals Experimental analysis of parallel plate and crosscut pin fin heat sinks for electronic cooling applications

2010 ◽  
Vol 14 (1) ◽  
pp. 147-156 ◽  
Author(s):  
Harish Sivasankaran ◽  
Godson Asirvatham ◽  
Jefferson Bose ◽  
Bensely Albert
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Parallel Plate ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Average Heat Transfer Coefficient ◽  
Average Heat ◽  
Pin Fin ◽  
Pin Fins

Experimental investigation of parallel plate fin and the crosscut pin fin heat sinks where the heating element placed asymmetrically is performed. Theoretical calculations were done and compared with the experimental results. A comparative study was made based on their efficiencies, heat transfer coefficient, and the thermal performance. From the experimental results it was found that the average heat transfer coefficient of parallel plate fins is higher than that of crosscut pin fins with many perforations. However the performance efficiency of both the crosscut pin fins and parallel plate fins is similar. A hybrid approach was employed to significantly optimize the distance between the fan and heat sink for parallel plate and crosscut pin fins. Parallel plate heat sink with an average heat transfer coefficient of 46 W/m?K placed at an optimum fan distance of 40-60 mm is selected as the suitable choice for the micro-electronic cooling when the heating element is placed asymmetrically.

Designs of Multiple Microchannel Heat Transfer Systems

2011 ◽  
Author(s):  
Jingru Zhang ◽  
Po Ting Lin ◽  
Yogesh Jaluria
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Optimization Problems ◽  
Numerical Models ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Channel Height ◽  
Physical Constraints ◽  
Temperature And Pressure

In this paper, two different configurations of multiple microchannel heat sinks with fluid flow are investigated for electronic cooling: straight and U-shaped channel designs. Numerical models are utilized to study the multiphysics behavior in the microchannels and validated by comparisons with experimental results. Three responses, including thermal resistance, pressure drop, and maximum temperature, are parametrically modeled with respect to various variables such as dimensions of the channels, total number of channels, and flow rate. Multi-objective optimization problems, which minimize the thermal resistance and the pressure drop simultaneously, are formulated and studied. Physical constraints in terms of channel height, maximum temperature, and pressure are further investigated. The Pareto frontiers are studied and the trade-off behavior between the thermal resistance and the pressure drop are discussed.

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