Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology

2006 ◽  
Vol 29 (1) ◽  
pp. 39-46 ◽  
Author(s):  
Yingjun Cheng ◽  
Gaowei Xu ◽  
Dapeng Zhu ◽  
Wenjie Zhu ◽  
L. Luo
2016 ◽  
Vol 48 (4) ◽  
pp. 859-869 ◽  
Author(s):  
Janani Murallidharan ◽  
Giovanni Giustini ◽  
Yohei Sato ◽  
Bojan Ničeno ◽  
Vittorio Badalassi ◽  
...  

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