Dielectric characterization of printed wiring board materials using ring resonator techniques: a comparison of calculation models

2006 ◽  
Vol 13 (4) ◽  
pp. 717-726 ◽  
Author(s):  
J.-M. Heinola ◽  
K. Tolsa
Keyword(s):  
Ring Resonator ◽  
Printed Wiring Board ◽  
Dielectric Characterization ◽  
Wiring Board ◽  
Calculation Models

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

2010 ◽  
Author(s):  
Mark Eblen
Keyword(s):  
Thermal Conductivity ◽  
Integrated Circuits ◽  
Effective Thermal Conductivity ◽  
Flip Chip ◽  
Heat Removal ◽  
Thermal Design ◽  
Printed Wiring Board ◽  
Wiring Board ◽  
High Lead

Thermal management of flip chip style integrated circuits often relies on thermal conduction through the ceramic package and high lead solder grid array leads into the printed wiring board as the primary path for heat removal. Thermal analysis of this package configuration requires accurate characterization of the sometimes geometrically complex package-to-board interface. Given the unique structure of the Six Sigma column grid array (CGA) interconnect, a detailed finite element submodel was used to numerically derive the effective thermal conductivity with comparisons to a conventional CGA interconnect. Once an effective thermal conductivity value is obtained, the entire interconnect layer can be represented as a fictitious cuboid layer for inclusion in a more traditional “closed-form” thermal resistance calculation. This method allows the package designer a quick and robust method to evaluate initial thermal design study tradeoffs.

scholarly journals DESTRUCTIVE DIELECTRIC CHARACTERIZATION OF MATERIAL USING MICROSTRIP RING RESONATOR.

2018 ◽  
Vol 6 (6) ◽  
pp. 402-413 ◽  
Author(s):  
Hussein Kassem ◽  
◽  
HayssamEl Hajj ◽  
Rabih Rammal ◽  
IsmailEl Sayad ◽  
...  
Keyword(s):  
Ring Resonator ◽  
Dielectric Characterization ◽  
Microstrip Ring ◽  
Microstrip Ring Resonator

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

1993 ◽  
Vol 115 (4) ◽  
pp. 366-372 ◽  
Author(s):  
G. G. Stefani ◽  
N. S. Goel ◽  
D. B. Jenks
Keyword(s):  
Numerical Technique ◽  
Thermal Characterization ◽  
Computer Time ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Equivalent Parameter ◽  
Finite Element Package ◽  
Multiple Materials ◽  
Wiring Board

Thermal modeling of Surface Mount Technology (SMT) microelectronics packages is difficult due to the complexity of the printed wiring board (PWB) plates through hole (PTH) structure. A simple, yet powerful finite difference based approach, called EPIC (Equivalent Parameter for Interfacial Cells), for modelling complex 2-D and 3-D geometries with multiple materials is used to model the PTH structure. A technique for computing an effective thermal conductivity for the PWB is presented. The results compare favorably with those from a commercially available finite element package but require far less computer time.

Analytic Characterization of Area Array Interconnect Shear Force Behavior

2002 ◽  
Author(s):  
Donald B. Barker ◽  
Brent M. Mager ◽  
Michael D. Osterman
Keyword(s):  
Shear Force ◽  
Electronic Devices ◽  
Failure Model ◽  
Printed Wiring Board ◽  
Shear Forces ◽  
Area Array ◽  
Maximum Shear Force ◽  
Cte Mismatch ◽  
Wiring Board

Shear forces in the interconnects of electronic devices can cause electrical opens, which result in device failure. The shear forces are often caused by the thermal expansion (CTE) mismatch between a component and the printed wiring board (PWB). In this paper, an elastic strength of materials analytic model, which is demonstrated by Vandevelde [21], is used to characterize the interconnect shear force behavior in area array packages. The benefit of modeling the shear forces is that they can be related to the device life, a relationship obtained by converting shear to average stress, which can be converted to strain and used as input in a failure model equation. The most significant characterization that will be presented is that the maximum shear force behavior in the outermost interconnects can be characterized by three distinct regions of maximum shear force behavior.

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