Design and performance of wireless power transfer with high temperature superconducting resonance antenna

Author(s):  
Yoon Do Chung ◽  
Dae Wook Kim ◽  
Seong Woo Yim
2014 ◽  
Vol 24 (3) ◽  
pp. 1-5 ◽  
Author(s):  
GuoMin Zhang ◽  
Hui Yu ◽  
Liwei Jing ◽  
Jincheng Li ◽  
Qi Liu ◽  
...  

2019 ◽  
Author(s):  
Kosuke Tachikawa ◽  
Morris Kesler ◽  
Milisav Danilovic ◽  
Bryan Esteban ◽  
Oguz Atasoy ◽  
...  

Author(s):  
Masood Rehman ◽  
Zuhairi Baharudin ◽  
Perumal Nallagownden ◽  
Badar Ul Islam

<p>Wireless power transfer (WPT) system has got significant attention in recent years due to its applications in consumer electronics, medical implants and electric vehicles etc. WPT is a promising choice in situations, where the physical connectors can be unreliable and susceptible to failure. The efficiency of WPT system decreasing rapidly with increasing air-gap. Many circuit topologies have been employed to enhance the efficiency of the WPT system. This paper presents the modelling and performance analysis of resonant wireless power transfer (RWPT) system using series-parallel-mixed topology. The power transfer efficiency analysis of the model is investigated via circuit theory. S-parameters have been used for measuring power transfer efficiency. Transient analysis is performed to realize the behavior of voltage and current waveforms using advanced design system (ADS) software. The proposed model is tested with two amplitudes i.e. 100 V peak-to-peak and 110 V peak-to-peak at the same frequency of 365.1 kHz. The overall result shows that the series-parallel-mixed topology model has higher efficiency at low coupling factor (K) for both voltage amplitudes.</p>


2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000251-000254
Author(s):  
L.E. Kegley ◽  
J. Garrett ◽  
S. Minden ◽  
J. Fraley

A high temperature, SiC-based wireless power demonstrator has been demonstrated by APEI engineers under Air Force Research Lab (AFRL) funding. The system consists of high temperature (&gt; 225 °C) assembly processes and materials, including the ceramic substrate, die attach, and components. The wireless power transfer is demonstrated at different distances with respect to temperature. This system has significant implications for extreme environment applications which would benefit from condition-based monitoring.


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