Utilization of Healthcare Services and Drug Consumption in Fibromyalgia: A Cross‐Sectional Analysis of the Clalit Health Service Database

Author(s):  
Omer Gendelman ◽  
Raz Shapira ◽  
Shmuel Tiosano ◽  
Yuval Kuntzman ◽  
Avishai M Tsur ◽  
...  
Revizor ◽  
2021 ◽  
Vol 24 (93) ◽  
pp. 17-25
Author(s):  
Milorad Stamenović

Out-of-pocket expenses in healthcare show the level of direct payments by individuals paying for the healthcare services that are not covered by the insurance. In the Republic of Serbia, high level of out-of-pocket expenses is present considering dominant Bismarck model of healthcare system and level of user income. Previous research shows the significant impact of the socio-economic and healthcare system indicators afecting out-of-pocket expenses. The objective is to perform a cross-sectional analysis of the economic, healthcare, and demographic variables impact on the out-of-pocket expenses. We use quantitative methods of analysis of data collected for the data time frame from 20002018. Results show a high impact of the 7 out of 13 factors we explored.


2012 ◽  
Vol 58 (4) ◽  
pp. 472-476 ◽  
Author(s):  
Caroline Filla Rosaneli ◽  
Flavia Auler ◽  
Carla Barreto Manfrinato ◽  
Claudine Filla Rosaneli ◽  
Caroline Sganzerla ◽  
...  

2017 ◽  
Vol 48 (S 01) ◽  
pp. S1-S45
Author(s):  
M. Zielonka ◽  
S. Garbade ◽  
S. Kölker ◽  
G. Hoffmann ◽  
M. Ries

2019 ◽  
Author(s):  
Patricia Clark ◽  
Annarella Barbato ◽  
Miguel Angel Guagnelli ◽  
Jose Alberto Rascon ◽  
Edgar Denova ◽  
...  

Diabetes ◽  
2020 ◽  
Vol 69 (Supplement 1) ◽  
pp. 2174-PUB
Author(s):  
NARAYANAN NK ◽  
CS DWARAKANATH ◽  
VENKATARAMAN S ◽  
MANIKANDAN RM ◽  
NARENDRA BS ◽  
...  

Author(s):  
B. Domengès ◽  
P. Poirier

Abstract In this study, the resistance of FIB prepared vias was characterized by the Kelvin probe technique and their physical characteristics studied using cross-sectional analysis. Two domains of resistivity were isolated in relation to the ion beam current used for the deposition of the via metal (Pt). Also submicrometer vias were investigated on 4.2 µm deep metal lines of a BiCMOS aluminum based design and a CMOS 090 copper based one. It is shown that the controlling parameter is the shape and volume of the contact, and that the contact formation is favored by the amount of over-mill of the via into the metal line it will contact.


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