scholarly journals Indentation densification of fused silica assessed by raman spectroscopy and constitutive finite element analysis

2020 ◽  
Vol 103 (5) ◽  
pp. 3076-3088 ◽  
Author(s):  
Sebastian Bruns ◽  
Tobias Uesbeck ◽  
Sindy Fuhrmann ◽  
Mariona Tarragó Aymerich ◽  
Lothar Wondraczek ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Raman Spectroscopy ◽  
Finite Element ◽  
Fused Silica ◽  
Element Analysis

Sharp indentation stress fields in fused silica: Finite element analysis and Yoffe analytic model

2020 ◽  
Vol 103 (12) ◽  
pp. 7135-7146
Author(s):  
Brian C. Davis ◽  
G. Scott Glaesemann ◽  
Ivar Reimanis
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fused Silica ◽  
Stress Fields ◽  
Analytic Model ◽  
Element Analysis ◽  
Sharp Indentation

Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis

2013 ◽  
Vol 106 ◽  
pp. 139-143 ◽  
Author(s):  
F. Le Texier ◽  
J. Mazuir ◽  
M. Su ◽  
L. Castagné ◽  
J.-C. Souriau ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Raman Spectroscopy ◽  
Finite Element ◽  
Stress Concentration ◽  
Local Stress ◽  
Element Analysis ◽  
Local Stress Concentration ◽  
Micro Raman Spectroscopy ◽  
Spectroscopy Measurement

Micro-Raman Study of Stress Distribution and Thermal Relaxation of Oxidized Silicon Membranes

1996 ◽  
Vol 444 ◽  
Author(s):  
C. Malhaire ◽  
Y. Guyot ◽  
M. Le Berre ◽  
B. Champagnonn ◽  
A. Sibai ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Raman Spectroscopy ◽  
Finite Element ◽  
Stress Distribution ◽  
Pressure Sensors ◽  
Biaxial Stress ◽  
Membrane Thickness ◽  
Element Analysis ◽  
Membrane Area ◽  
Micro Raman Spectroscopy

AbstractComposite SiO2/Si membranes are used in various type of sensors among them, resonant and pressure sensors. However due to a large thermal mismatch, residual induced stresses may affect the devices long term reliability especially for thin membranes (˜5 μm). In this study, we have characterized test structures consisting of SiO2/Si membranes with respective thickness ratio between 2 and 10. Micro-Raman Spectroscopy, well known to be an accurate, non destructive method to determine residual stresses in microelectronic devices, has shown to be a powerful testing technique to measure local stresses on micromachined structures such as membranes, with a high spatial (10 μm2 ) and stress resolution (8 MPa). At room temperature, Raman line (520 cm−1) shifts between 0.05 and 1 cm−1 are observed. Highest frequency shifts of 1cm−1 corresponds to a 230 MPa biaxial stress. Finite Element analysis (ANSYS) was used to model the thermal stress distribution over the micromachined bilayer membrane, yielding a satisfactorily agreement with the experimental results over a large membrane area. The Finite Element analysis was correlated with optical profilometer deflection measurements. Membrane deflections up to 48 μm (more than 10 times the membrane thickness) have been measured. Furthermore, Micro-Raman Spectroscopy results up to 300°C are shown and related to temperature dependent deflection measurements.

scholarly journals Effects of Indenter Tilt on Nanoindentation Results of Fused Silica: an Investigation by Finite Element Analysis

2013 ◽  
Vol 54 (6) ◽  
pp. 958-963 ◽  
Author(s):  
Chengli Shi ◽  
Hongwei Zhao ◽  
Hu Huang ◽  
Lixia Xu ◽  
Luquan Ren ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fused Silica ◽  
Element Analysis

Influence of Nanoindenter Tip Radius on the Estimation of the Elastic Modulus

2011 ◽  
Vol 1297 ◽  
Author(s):  
Karim R. Gadelrab ◽  
Matteo Chiesa
Keyword(s):  
Finite Element Analysis ◽  
Experimental Study ◽  
Finite Element ◽  
Elastic Modulus ◽  
Elastic Properties ◽  
Analytical Model ◽  
Fused Silica ◽  
Numerical Results ◽  
Element Analysis ◽  
Tip Radius

ABSTRACTNanoindentation results are very sensitive to tip rounding and neglecting the value of the tip radius produces erroneous estimation of the material elastic properties. In this study we investigate the effect of tip radius on the estimation of the Elastic modulus by means of finite element analysis of Berkovich and conical tips with different tip radii. Our numerical results were already supported by an experimental study on fused silica with Berkovich tips with different tip radii. The use of classical Oliver Pharr equation overestimated the Elastic modulus. A new analytical model that modifies the Oliver Pharr equation to consider the value of the tip radius is employed to derive the Elastic modulus from load displacement curves yielding improved results compared to the classical Oliver Pharr equation.

Illustrative analysis of load-displacement curves in nanoindentation

2007 ◽  
Vol 22 (11) ◽  
pp. 3075-3086 ◽  
Author(s):  
A.C. Fischer-Cripps
Keyword(s):  
Mechanical Properties ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Pressure Distribution ◽  
Fused Silica ◽  
Uniform Pressure ◽  
Berkovich Indenter ◽  
Element Analysis ◽  
Physical Reason ◽  
Elastic Unloading

The nature of the elastic unloading after an elastic-plastic contact with a conical or Berkovich indenter is studied. Three representative specimens having different mechanical properties were tested. Finite-element results for the pressure distribution beneath the indenter during unloading suggest that the effective indenter is in fact very closely approximated by a sphere in the case of fused silica (a material with a relatively low value of E/H) and a more uniform pressure distribution in the case of silicon and sapphire (materials with higher values of E/H). The proposed reason for these observations is the extent and influence of an elastic enclave directly beneath the indenter as revealed by finite-element analysis. The results also show that the pressure distribution retains its form during the entire unloading. The work seeks to provide a physical reason for the value of the fitting exponent m as used in popular nanoindentation data analysis procedures.

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