Impact of Low Temperatures on Solder Joint Failures
2002 ◽
Vol 124
(2)
◽
pp. 135-137
◽
Keyword(s):
An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. In this experiment, the low temperatures caused high peeling stresses in the heel area of solder joints and, as usual, relatively low plastic shear strain (as compared with these strains at high temperatures). This fact suggests that the impact of solder peeling stresses on the solder failure is noticeably higher than is anticipated by applying the commonly used failure criteria.
2014 ◽
Vol 3
(3)
◽
pp. 1-16
◽
Keyword(s):
2010 ◽
Vol 132
(2)
◽
2021 ◽
Vol ahead-of-print
(ahead-of-print)
◽
Keyword(s):
1976 ◽
Vol 98
(3)
◽
pp. 244-248
◽
Keyword(s):
2006 ◽
Vol 312
◽
pp. 299-304
◽
Keyword(s):
1981 ◽
Vol 16
(2)
◽
pp. 85-95
◽
Keyword(s):
2010 ◽
Vol 47
(5)
◽
pp. 723-738
◽
2009 ◽
Vol 75
(758)
◽
pp. 1395-1401