A Discussion on Material Removal Mechanisms in Grinding of Cemented Carbides

2017 ◽  
Vol 139 (12) ◽  
Author(s):  
Christian Wirtz ◽  
Sebastian Mueller ◽  
Patrick Mattfeld ◽  
Fritz Klocke
Keyword(s):  
Material Removal ◽  
Brittle Materials ◽  
Material Behavior ◽  
Cemented Carbides ◽  
Surface Zone ◽  
Scanning Electron Micrographs ◽  
Material Removal Mechanisms ◽  
Ductile Materials ◽  
Removal Mechanisms ◽  
The Impact

In the literature, cemented carbides are described as hard and brittle materials. The material removal mechanisms in grinding of brittle materials, such as cemented carbides, significantly differ from the material removal mechanisms of ductile materials [1–3]. The material removal mechanisms in grinding of ductile materials are comparatively well investigated in comparison to the material removal mechanisms in grinding of brittle materials. In the existing literature, it has been shown that the material removal mechanisms in grinding of cemented carbides can be ductile or brittle. The present material removal mechanisms are dependent on the thermomechanical stress collective, which acts on the surface zone of the cemented carbides. In this paper, the material removal mechanisms in grinding of cemented carbides are discussed fundamentally. In order to analyze the occurring material removal mechanisms in grinding of cemented carbides, single grain cutting tests were carried out. Subsequent to the tests, the surface zone of the cemented carbide has been analyzed in detail. Therefore, scanning electron micrographs have been made to analyze the workpiece surface to identify the transition from predominantly ductile to predominantly brittle material behavior. Furthermore, focused ion beam (FIB) preparation, which has minimum invasive influence on the subsurface, was applied in order to get an insight into the surface zone. The FIB lamellae have been analyzed with transmission electron microscopy (TEM) to get a better understanding of the impact of material removal mechanisms on the surface zone. The drawn conclusions contribute to an improved process understanding in grinding of cemented carbides.

Material Removal Mechanisms Involved in Rotary Ultrasonic Machining of Brittle Materials

2007 ◽  
Vol 329 ◽  
pp. 391-396 ◽  
Author(s):  
Choung Lii Chao ◽  
Wen Chen Chou ◽  
Chung Woei Chao ◽  
Chao Chang Arthur Chen
Keyword(s):  
Material Removal ◽  
Brittle Materials ◽  
Process Efficiency ◽  
Machining Parameters ◽  
Ultrasonic Machining ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanisms ◽  
Erosion Processes ◽  
Pull Out ◽  
Removal Mechanisms

Rotary ultrasonic machining (RUM) is considered to be a very effective and relatively accurate way to drill deep holes in brittle materials. Although brittle fracture (micro chipping) is the dominant material removal mechanism utilized by the RUM process, poor surface roughness and deep penetrated cracks are the consequence if the machining parameters are not properly controlled. To ensure the quality of the generated surface and to improve the process efficiency, efforts have been made in this study to correlate the material removal mechanisms, surface integrity and tool wear involved in the RUM process. Diamond-impregnated tools were used in the experiment and the ultrasonic vibration frequency was kept at 20 kHz. Three major material removal modes namely, impact mode, grinding mode and erosion mode were found to be the dominant removal processes at the tool tip, around the diamond wheel and around the steel sleeve respectively. It was also found that, during the grinding/erosion processes, the bonding material of the wheel was first eroded away and left big part of diamond grits well-exposed. Pull-out and/or fracture are normally the consequence of these exposed diamond grits due to the lack of support and protection.

Material removal mechanisms in grinding of two-phase brittle materials

2017 ◽  
Vol 95 (1-4) ◽  
pp. 287-298 ◽  
Author(s):  
Sebastian Mueller ◽  
Christian Wirtz ◽  
Daniel Trauth ◽  
Patrick Mattfeld ◽  
Fritz Klocke
Keyword(s):  
Material Removal ◽  
Brittle Materials ◽  
Two Phase ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

2017 ◽  
Vol 139 (8) ◽  
Author(s):  
Sagil James ◽  
Murali Sundaram
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Dynamics Simulation ◽  
Common Mechanism ◽  
Initial Kinetic Energy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
The Impact

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process to perform target-specific nano abrasive machining of hard and brittle materials. In this study, molecular dynamic (MD) simulations are performed to understand the nanoscale material removal mechanisms involved in the VANILA process. The simulation results revealed that the material removal for the given impact conditions happens primarily in ductile mode through three distinct mechanisms, which are nanocutting, nanoplowing, and nanocracking. It was found that domination by any of these mechanisms over the other mechanisms during the material removal process depends on the impact conditions, such as angle of impact and the initial kinetic energy of the abrasive grain. The transition zone from nanocutting to nanoplowing is observed at angle of impact of near 60 deg, while the transition from the nanocutting and nanoplowing mechanisms to nanocracking mechanism is observed for initial abrasive kinetic energies of about 600–700 eV. In addition, occasional lip formation and material pile-up are observed in the impact zone along with amorphous phase transformation. A material removal mechanism map is constructed to illustrate the effects of the impacts conditions on the material removal mechanism. Confirmatory experimentation on silicon and borosilicate glass substrates showed that all the three nanoscale mechanisms are possible, and the nanoplowing is the most common mechanism. It was also found that the material removal rate (MRR) values are found to be highest when the material is removed through nanocracking mechanism and is found to be lowest when the material removal happens through nanocutting mechanism.

Experiment Study on Abrasive Waterjet Machining Mechanisms of Brittle Materials

2008 ◽  
Vol 375-376 ◽  
pp. 62-66
Author(s):  
Hong Tao Zhu ◽  
Chuan Zhen Huang ◽  
Jun Wang ◽  
Quan Lai Li ◽  
Cui Lian Che
Keyword(s):  
Material Removal ◽  
Abrasive Particle ◽  
Brittle Materials ◽  
Target Material ◽  
Abrasive Waterjet ◽  
Clear Understanding ◽  
Experiment Study ◽  
Material Removal Mechanisms ◽  
Abrasive Waterjet Machining ◽  
Removal Mechanisms

The erosion process of abrasive waterjet (AWJ) on target material is very complicated and a complete clear understanding about material removal mechanisms in AWJ machining has not been obtained. In this paper, an experiment study on AWJ machining mechanisms of brittle materials is introduced so as to understand the actions of water jet and abrasive particle in material removal process and some experiment evidences of the change of material removal mechanisms have been obtained.

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