Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Volume 4 ◽  
2004 ◽  
Author(s):  
Katsuhiro Koizumi ◽  
Masaru Ishizuka
Keyword(s):  
Semiconductor Devices ◽  
Flow Simulation ◽  
Electric Circuit ◽  
Simulation Method ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Air Cooling ◽  
Thermal Flow ◽  
Power Semiconductor ◽  
Power Semiconductor Devices

This paper describes the development of a thermal flow simulation method for the design of electronic equipment. In the proposed sequence of analyses the first step is the estimation of heat generation rate from electric circuit. The method was applied to the thermal design of a new switch mode power supply (SMPS). The analysis was carried out using a computational fluid dynamics (CFD) code (Icepak: trademark of Fluent Inc.). In reducing the actual structural organizations of the printed circuit board (PCB) and the power semiconductor devices to simpler models the method of experimental design (MED) was employed. Following the prescription of MED the PCB was modeled as a simple plate having a thermal conductivity of epoxy resin. The power semiconductor devices were modeled by hexahedral resistance network. The heat sources are a field effect transistor (FET) and a diode, and computation of the power loss from them is described. The difference between measured and calculated temperatures on the power semiconductor devices was found to be within approximately 10 K.

Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

2003 ◽  
Author(s):  
Katsuhiro Koizumi ◽  
Akito Joboji ◽  
Kuniaki Nagahara ◽  
Masaru Ishizuka
Keyword(s):  
Natural Convection ◽  
Printed Circuit Board ◽  
Semiconductor Devices ◽  
Flow Simulation ◽  
Circuit Board ◽  
Switch Mode Power Supply ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Switch Mode ◽  
The Difference

This paper describes an application example of thermal flow simulation to the design of a switch mode power supply (SMPS) that is natural convection air-cooled. In this analysis, the modeling of printed circuit board (PCB) and power semiconductor devices was examined using the design of experiments method. The PCB was treated as a simple plate, and average thermal conductivity was not considered. The power semiconductor devices were modeled as a simple hexahedral resistive network block. As the heat generation sources, a field effect transistor (FET) and a diode were considered in the simulation, and the calculation method of power loss is described. The difference between measured and calculated values for power semiconductor devices was found to be within approximately 10 K.

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

2009 ◽  
Author(s):  
Katsuhiro Koizumi ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa
Keyword(s):  
Thermal Model ◽  
Thermal Modeling ◽  
Flow Simulation ◽  
Modeling Method ◽  
Operating Conditions ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Electrolytic Capacitor ◽  
Thermal Flow ◽  
Electrolytic Capacitors

The electrolytic capacitor is one of the most important components for the thermal analysis of electronic equipment. To predict component and system temperatures, the thermal flow simulation technique has been applied to thermal design in the development phase of electronic equipment. In this study, we examined a compact modeling method for electrolytic capacitors in order to simulate thermal flow based on the computational fluid dynamics (CFD) code. To obtain fundamental data for the thermal modeling method, first, we conducted experiments to identify the major thermal path of electrolytic capacitors in actual electronic equipment by using a switch mode power supply unit. Next, to verify the validity of the thermal model, a benchmark experiment was conducted to obtain actual measurement data of the temperature rise of electrolytic capacitors under various operating conditions. The thermal model of the electrolytic capacitor was presented based on the CFD code, which is a commercially available thermal flow simulation tool. In this paper, we describe in particular the snap-in type electrolytic capacitor.

Residual Voids in Degassing Process of Encapsulation Gel for Power Semiconductor Devices

2014 ◽  
Vol 134 (6) ◽  
pp. 432-433
Author(s):  
Masahiro Sato ◽  
Akiko Kumada ◽  
Kunihiko Hidaka ◽  
Keisuke Yamashiro ◽  
Yuji Hayase ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices
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