Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

2009 ◽  
Author(s):  
Kisho Ashida ◽  
Kenya Kawano ◽  
Naotaka Tanaka ◽  
Atsushi Nishikizawa ◽  
Nobuya Koike
Keyword(s):  
Fracture Strength ◽  
Bending Test ◽  
Lead Frame ◽  
Reflow Soldering ◽  
Strength Evaluation ◽  
Silver Paste ◽  
Three Point Bending ◽  
Soldering Process ◽  
Die Bonding ◽  
Copper Lead

Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure. First, we assumed that the fracturing was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the silver paste fracture strength using a three-point bending test and a bonded specimen with silver paste. Finally, we predicted the occurrence of silver paste fracturing by calculating the silver paste stress during reflow soldering process and comparing it with the measured fracture strength. Results obtained in strength evaluation analysis were consistent with those obtained in package reflow tests, indicating that this method can be used to predict the occurrence of silver paste fracturing.

4326 Strength Evaluation of Ag Paste for Die Bonding During Reflow Soldering

2006 ◽  
Vol 2006.6 (0) ◽  
pp. 209-210
Author(s):  
Kisho ASHIDA ◽  
Kenya KAWANO ◽  
Naotaka TANAKA ◽  
Hiroyuki NAKAMURA
Keyword(s):  
Reflow Soldering ◽  
Strength Evaluation ◽  
Die Bonding ◽  
Ag Paste

Study on Fracture Strength Evaluation Method of Silver Paste for Die Attaching

2004 ◽  
Vol 2004 (0) ◽  
pp. 247-248
Author(s):  
Kisho ASHIDA ◽  
Kenya KAWANO ◽  
Naotaka TANAKA ◽  
Hidemasa KAGII
Keyword(s):  
Fracture Strength ◽  
Evaluation Method ◽  
Strength Evaluation ◽  
Silver Paste

scholarly journals Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

2010 ◽  
Vol 76 (770) ◽  
pp. 1359-1366
Author(s):  
Kisho ASHIDA ◽  
Kenya KAWANO ◽  
Naotaka TANAKA ◽  
Atsushi NISHIKIZAWA ◽  
Nobuya KOIKE
Keyword(s):  
Conductive Adhesive ◽  
Reflow Soldering ◽  
Strength Evaluation ◽  
Die Bonding

Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen
Keyword(s):  
Failure Analysis ◽  
Chemical Etching ◽  
Chemical Resistance ◽  
Etching Time ◽  
Lead Frame ◽  
Front Side ◽  
Electrical Measurements ◽  
Mechanical Preparation ◽  
Die Surface ◽  
Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

scholarly journals Additive Manufacturing-Based In Situ Consolidation of Continuous Carbon Fibre-Reinforced Polycarbonate

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2450
Author(s):  
Andreas Borowski ◽  
Christian Vogel ◽  
Thomas Behnisch ◽  
Vinzenz Geske ◽  
Maik Gude ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Carbon Fibre ◽  
Bending Test ◽  
Thermoplastic Composites ◽  
Experimental Investigations ◽  
Material Structure ◽  
Three Point Bending ◽  
Continuous Fibre ◽  
Local Material

Continuous carbon fibre-reinforced thermoplastic composites have convincing anisotropic properties, which can be used to strengthen structural components in a local, variable and efficient way. In this study, an additive manufacturing (AM) process is introduced to fabricate in situ consolidated continuous fibre-reinforced polycarbonate. Specimens with three different nozzle temperatures were in situ consolidated and tested in a three-point bending test. Computed tomography (CT) is used for a detailed analysis of the local material structure and resulting material porosity, thus the results can be put into context with process parameters. In addition, a highly curved test structure was fabricated that demonstrates the limits of the process and dependent fibre strand folding behaviours. These experimental investigations present the potential and the challenges of additive manufacturing-based in situ consolidated continuous fibre-reinforced polycarbonate.

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