Hydrophilicity Control of Ag-Paste Electrodes by UV/Ozone Treatment

Ag-paste is used as an electrode material in various fields as a manufacturing advantage that enables solution processing. However, when a subsequent thin film is formed on the solidified Ag-paste electrode, there is a fear that the bonding force between the Ag-paste electrode and the subsequent thin film is weakened and peeled off due to the low surface energy of the Agpaste electrode. It is necessary to increase the surface energy of the Ag-paste electrode surface since it ultimately directly affects the yield of the device or product. In this study, the UV/ozone treatment process was introduced to increase the Ag-paste surface energy, thereby making the surface hydrophilic. Additionally, it was confirmed that the UV/ozone treatment process affected only the surface of the Ag-paste electrode by extracting the contact resistance.

Fabrication and Characterization of Physical and Mechanical Properties of Carbon Nanotubes—Graphene-Based Sandwich Composite Pressure Sensor

In this work, piezoresistive properties of graphene-multiwalled carbon nanotubes (MWCNTs) composites are investigated, characterized, and compared. Sandwich-type composite piezoresistive pressure-sensitive sensors (Ag/Graphene-MWCNT/Ag) with the same diameters, but different fabrication pressures and thicknesses were fabricated using the mortar and pestle/hydraulic press technique. To produce low-electrical-resistance contacts, both sides of the composite sensors were painted with silver (Ag) paste. All the sensors showed reductions in the direct current (DC) resistance ‘R’ with an increment in external uniaxial applied pressure. However, it was observed that higher fabrication pressure led to a lower resistance value of the composite, while the thicker samples give lower electrical conductivity and higher resistance than the thinner samples. The experimental data for all composite pressure sensors were in excellent agreement with the simulated results.

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

Low-temperature sintered Ni–Zn–Co–Mn–O spinel oxide ceramics for multilayer NTC thermistors

The phase formation, sintering behavior and electrical properties of Ni–Co–Zn–Mn spinel NTC thermistor ceramics of the series Ni0.5ZnzCo0.5Mn2−zO4 with 0 ≤ z ≤ 1 were studied. In contrast to NiMn2O4, which exhibits limited stability in air below 730 °C and above 970 °C, the Zn–Co-substituted nickel manganite spinels are stable at T < 730 °C and decompose at Td > 900 °C, with Td increasing with decreasing Zn Content z. The samples were sintered at 900 °C with addition of 3 wt% Bi2O3 as sintering aid and densities of above 92% were achieved. The room temperature resistivity and thermistor B-constants are almost independent of composition at 0 ≤ z ≤ 0.6 and start to increase at higher Zn concentrations. A multilayer NTC thermistor was fabricated using green tapes of a spinel of composition z = 0.75, commercial Ag paste, and cofiring at 900 °C. The firing behavior, microstructure formation and electrical properties of the multilayer thermistor are reported.