Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

This paper presents the results of an experimental study of steady state heat conduction in a three dimensional stack package. The temperatures are measured at different interfaces within the stacked package. Delphi devices are used in the experiment which enables controlled power input and surface temperature of the devices. The experiment is carried out for three different boundary conditions on the package. The power input in varied to study its effects. A numerical model is created to compare to the experimental results. The results are also compared with the analytical solution presented in Desai et al [5] and Geer et al [6]. The results indicate that the experimental, numerical and analytical solutions follow the same trend. The agreement between the experimental and numerical results improves when the lateral losses are taken into account.