An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

2017 ◽  
Author(s):  
Jing Wang ◽  
Yuling Niu ◽  
Seungbae Park
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Solder Reflow ◽  
Delamination Behavior

In this study, the moisture induced delamination behavior of a plastic ball grid array package under the solder reflow process was investigated by the finite element analysis. The entire moisture history of the PBGA package was simulated for preconditioning at moisture sensitivity level 1 and the subsequent exposure to a soldering reflow. A fracture mechanics based analysis was used to investigate the combined effects of temperature, moisture and vapor pressure on the delamination behavior at the die/molding compound and die/die attach interfaces during solder reflow. For determining the total strain energy release rate and total stress intensity factor under a multiphysics environment like reflow, researchers commonly used the principle of superposition to combine the results from individual thermal stress, hygroscopic stress and vapor pressure induced stress analyses. In this study, a new method was proposed to obtain the total strain energy release rate and total stress intensity factor under the multi-physics environment in a single fracture analysis instead of three. Two different methods-virtual crack closure technique (VCCT) and crack tip opening displacement method (CTOD) were employed and compared in studying the variation of strain energy release rates during lead-free solder reflow. The relationship between the strain energy release rate and crack length was also obtained. The developments of the stress intensity factors due to individual effect of thermal mismatch, hygroscopic swelling and vapor pressure were calculated. The mode mixity was also determined under different temperatures and crack length.

Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package

2005 ◽  
Vol 2 (3) ◽  
pp. 197-207
Author(s):  
Fu-Mauh Wong ◽  
K.N Seetharamu
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Interfacial Crack ◽  
Strain Energy Release ◽  
Geometrical Parameters ◽  
High Tendency ◽  
Solder Reflow

Experiment has been conducted to measure the solubility Csat of mold compound and to obtain the moisture weight loss curves at various temperature. Moisture desorption modeling has been conducted to calculate the moisture diffusivity for desorption D(T) by matching with the experimental results. Finite Element Analysis (FEA) has also been conducted to calculate the transient development of strain energy release rate (ERR) at the interfacial crack tip due to thermal stress only (Gt), hygrostress only (Gh), and the combined effect (Gtotal) during solder reflow. ERR is computed based on the Virtual Crack Closure Technique (VCCT). It is found that Gh is significantly smaller than Gt, however the effect of hygrostress significantly increases the total strain energy release rate when combined with the thermal effect. The maximum Gtotal occurs at the peak of the solder reflow profile. The effects of crack size and geometrical parameters have been studied. The result imply that the interfacial crack is unstable and has a high tendency of growing to a significant extent. ERR is strongly influenced by the thickness of the package while length between the edge of die and pad has a moderate affect on the ERR.

A new method for determining the strain energy release rate of an interface via force–depth data of nanoindentation tests

2008 ◽  
Vol 20 (2) ◽  
pp. 025701 ◽  
Author(s):  
Pal Jen Wei ◽  
Wen Long Liang ◽  
Chi Fong Ai ◽  
Jen Fin Lin
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
New Method ◽  
Depth Data

On the Axial Rigidity of a Perforated Strip and the Strain Energy Release Rate in a Centrally Notched Strip Subjected to Uniaxial Tension

1964 ◽  
Vol 86 (4) ◽  
pp. 693-697 ◽  
Author(s):  
R. G. Forman ◽  
A. S. Kobayashi
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Uniaxial Tension ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Theoretical Studies ◽  
Correction Factors ◽  
Elasticity Solutions

This paper presents theoretical studies on the axial rigidities in strips with circular and elliptical perforations and subjected to uniaxial tension. Greenspan’s original derivations on these axial rigidities [2] were improved by using the elasticity solutions by Howland [6] and Ishida [7] for infinite strips with circular and elliptical perforations, respectively. Finally, the correction factors for centrally notched strips subjected to uniaxial tension were rederived from the above results following the energy approach by Irwin and Kies [3].

Nonlinear Approach for Strain Energy Release Rate in Micro Cantilevers

2010 ◽  
Author(s):  
Arash Kheyraddini Mousavi ◽  
Seyedhamidreza Alaie ◽  
Maheshwar R. Kashamolla ◽  
Zayd Chad Leseman
Keyword(s):  
Surface Roughness ◽  
Crack Propagation ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Rigid Substrate ◽  
Micro Cantilever

An analytical Mixed Mode I & II crack propagation model is used to analyze the experimental results of stiction failed micro cantilevers on a rigid substrate and to determine the critical strain energy release rate (adhesion energy). Using nonlinear beam deflection theory, the shape of the beam being peeled off of a rigid substrate can be accurately modeled. Results show that the model can fit the experimental data with an average root mean square error of less than 5 ran even at relatively large deflections which happens in some MEMS applications. The effects of surface roughness and/or debris are also explored and contrasted with perfectly (atomically) flat surfaces. Herein it is shown that unlike the macro-scale crack propagation tests, the surface roughness and debris trapped between the micro cantilever and the substrate can drastically effect the energy associated with creating unit new surface areas and also leads to some interesting phenomena. The polysilicon micro cantilever samples used, were fabricated by SUMMIT V™ technology in Sandia National Laboratories and were 1000 μm long, 30 μm wide and 2.6 μm thick.

Influence of Loading History on Delamination in Multilayered Beam with Creep

2021 ◽  
Vol 1046 ◽  
pp. 23-28
Author(s):  
Victor Iliev Rizov
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Time Dependent ◽  
External Loading ◽  
Loading History ◽  
Multilayered Beam

The present paper deals with an analytical study of the time-dependent delamination in a multilayered inhomogeneous cantilever beam with considering of the loading history. The multilayered beam exhibits creep behaviour that is treated by using a non-linear stress-strain-time relationship. The material properties are continuously distributed along the thickness and length of the layers. The external loading is applied in steps in order to describe the loading history. The analysis reveals that during each step of the loading, the strain energy release rate increases with time. The influences of crack length and location on the time-dependent strain energy release rate are also investigated.

scholarly journals Influence of ceramic dental crown coating substrate thickness ratio on strain energy release rate

2017 ◽  
Vol 908 ◽  
pp. 012018
Author(s):  
K Khasnulhadi ◽  
R Daud ◽  
F Mat ◽  
S N F M Noor ◽  
K S Basaruddin ◽  
...  
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Thickness Ratio ◽  
Substrate Thickness ◽  
Dental Crown

Accurate evaluation of strain-energy release rate in unidirectional FRP compact-tension specimen

1997 ◽  
Vol 58 (3) ◽  
pp. 163-172 ◽  
Author(s):  
R. Ramesh Kumar ◽  
M.K. Jana ◽  
G. Venkateswara Rao ◽  
K.S. Anoop Kumar
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Compact Tension ◽  
Compact Tension Specimen ◽  
Tension Specimen ◽  
Accurate Evaluation

Effect of Plastic Deformation on the Strain Energy Release Rate in a Centrally Notched Plate Subjected to Uniaxial Tension

1966 ◽  
Vol 88 (1) ◽  
pp. 82-86 ◽  
Author(s):  
R. G. Forman
Keyword(s):  
Plastic Deformation ◽  
Energy Release Rate ◽  
Energy Release ◽  
Uniaxial Tension ◽  
Correction Factor ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Linear Elastic

This paper presents theoretical studies on the effect of plastic deformation on the strain energy release rate, G, of a plate under uniaxial tension with a central propagating crack. The linear elastic fracture mechanics solution for G is improved by using the Dugdale model for the crack and yielded region to obtain the axial rigidity of the plate. The axial rigidity is then used to obtain the solution for the strain energy release rate as the crack propagates. It is found that plastic deformation has a pronounced effect on G. A correction factor is presented for correcting the linear elastic solution for the strain energy release rate. The correction factor is found to depend upon the nominal (gross) stress to material yield stress ratio and the crack length to plate width ratio.

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