Real-time system for measuring three-dimensional shape of solder bump array by focus using varifocal mirror

2007 ◽  
Author(s):  
Akira Ishii ◽  
Haruka Tai ◽  
Jun Mitsudo
2019 ◽  
Vol 58 (04) ◽  
pp. 1 ◽  
Author(s):  
Guangkai Fu ◽  
Yiping Cao ◽  
Yapin Wang ◽  
Yingying Wan ◽  
Lu Wang ◽  
...  

Optik ◽  
2015 ◽  
Vol 126 (21) ◽  
pp. 2781-2787 ◽  
Author(s):  
Dawu He ◽  
Yiping Cao ◽  
Dinggao He ◽  
Song Sun

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