Combined Damage Influence Prediction of Curved Composite Structural Responses Using VCCT Technique and Experimental Verification

Author(s):  
Vikash Kumar ◽  
Hukum Chand Dewangan ◽  
Nitin Sharma ◽  
Subrata Kumar Panda

The influences of crack and delamination on the natural frequency and strain energy release rate of the laminated doubly curved shell structure are computed via a commercial finite element tool (ABAQUS). The effect of individual damages (crack and delamination) is modeled using the virtual crack closure technique (VCCT), considering the curvature effect. Initially, the model validity is established by comparing the results with the available results in the open domain. Additionally, the model validity has been verified via in-house experimentation for frequency responses. Further, the natural frequency and strain energy release rate (SERR) have been calculated for the structure to examine the influences of the individual or combined effect of damages by varying the design-dependent input geometrical parameters. The inclusive characteristics of the current model in conjunction with geometrical configurations are summarized for subsequent references.

2005 ◽  
Vol 2 (3) ◽  
pp. 197-207
Author(s):  
Fu-Mauh Wong ◽  
K.N Seetharamu

Experiment has been conducted to measure the solubility Csat of mold compound and to obtain the moisture weight loss curves at various temperature. Moisture desorption modeling has been conducted to calculate the moisture diffusivity for desorption D(T) by matching with the experimental results. Finite Element Analysis (FEA) has also been conducted to calculate the transient development of strain energy release rate (ERR) at the interfacial crack tip due to thermal stress only (Gt), hygrostress only (Gh), and the combined effect (Gtotal) during solder reflow. ERR is computed based on the Virtual Crack Closure Technique (VCCT). It is found that Gh is significantly smaller than Gt, however the effect of hygrostress significantly increases the total strain energy release rate when combined with the thermal effect. The maximum Gtotal occurs at the peak of the solder reflow profile. The effects of crack size and geometrical parameters have been studied. The result imply that the interfacial crack is unstable and has a high tendency of growing to a significant extent. ERR is strongly influenced by the thickness of the package while length between the edge of die and pad has a moderate affect on the ERR.


1964 ◽  
Vol 86 (4) ◽  
pp. 693-697 ◽  
Author(s):  
R. G. Forman ◽  
A. S. Kobayashi

This paper presents theoretical studies on the axial rigidities in strips with circular and elliptical perforations and subjected to uniaxial tension. Greenspan’s original derivations on these axial rigidities [2] were improved by using the elasticity solutions by Howland [6] and Ishida [7] for infinite strips with circular and elliptical perforations, respectively. Finally, the correction factors for centrally notched strips subjected to uniaxial tension were rederived from the above results following the energy approach by Irwin and Kies [3].


Author(s):  
Arash Kheyraddini Mousavi ◽  
Seyedhamidreza Alaie ◽  
Maheshwar R. Kashamolla ◽  
Zayd Chad Leseman

An analytical Mixed Mode I & II crack propagation model is used to analyze the experimental results of stiction failed micro cantilevers on a rigid substrate and to determine the critical strain energy release rate (adhesion energy). Using nonlinear beam deflection theory, the shape of the beam being peeled off of a rigid substrate can be accurately modeled. Results show that the model can fit the experimental data with an average root mean square error of less than 5 ran even at relatively large deflections which happens in some MEMS applications. The effects of surface roughness and/or debris are also explored and contrasted with perfectly (atomically) flat surfaces. Herein it is shown that unlike the macro-scale crack propagation tests, the surface roughness and debris trapped between the micro cantilever and the substrate can drastically effect the energy associated with creating unit new surface areas and also leads to some interesting phenomena. The polysilicon micro cantilever samples used, were fabricated by SUMMIT V™ technology in Sandia National Laboratories and were 1000 μm long, 30 μm wide and 2.6 μm thick.


2021 ◽  
Vol 1046 ◽  
pp. 23-28
Author(s):  
Victor Iliev Rizov

The present paper deals with an analytical study of the time-dependent delamination in a multilayered inhomogeneous cantilever beam with considering of the loading history. The multilayered beam exhibits creep behaviour that is treated by using a non-linear stress-strain-time relationship. The material properties are continuously distributed along the thickness and length of the layers. The external loading is applied in steps in order to describe the loading history. The analysis reveals that during each step of the loading, the strain energy release rate increases with time. The influences of crack length and location on the time-dependent strain energy release rate are also investigated.


1966 ◽  
Vol 88 (1) ◽  
pp. 82-86 ◽  
Author(s):  
R. G. Forman

This paper presents theoretical studies on the effect of plastic deformation on the strain energy release rate, G, of a plate under uniaxial tension with a central propagating crack. The linear elastic fracture mechanics solution for G is improved by using the Dugdale model for the crack and yielded region to obtain the axial rigidity of the plate. The axial rigidity is then used to obtain the solution for the strain energy release rate as the crack propagates. It is found that plastic deformation has a pronounced effect on G. A correction factor is presented for correcting the linear elastic solution for the strain energy release rate. The correction factor is found to depend upon the nominal (gross) stress to material yield stress ratio and the crack length to plate width ratio.


1994 ◽  
Vol 338 ◽  
Author(s):  
Edward O. Shaffer ◽  
Scott A. Sikorski ◽  
Frederick J. McGarry

ABSTRACTThe edge delamination test (EDT) is being developed to measure the critical energy required to cause a thin film, under biaxial tensile stress, to debond from a rigid substrate[1]. The test uses circular features etched through biaxially stressed films adhered to a rigid substrate. If the stress is large enough, a stable debond ring grows radially about the feature. We use a finite element analysis to model the test, solving for the applied strain energy release rate as a function of crack length, feature hole radius and other geometrical parameters. The model identifies both mode I and mode II components of the strain energy release rate, and agrees with previous analytical solutions for the total debond energy. However, the model predicts, with a very refined mesh at the crack tip, the fracture process is pure mode I. To explore this result, critical strain energy release rates from the EDT and the island blister test (IBT) are compared. This agreement supports the model prediction that the failure process in the EDT is modeI peeling.


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