Threading Dislocation Density Reduction in GaAs on Si Substrates

1988 ◽  
Vol 27 (Part 2, No. 12) ◽  
pp. L2271-L2273 ◽  
Author(s):  
Takashi Nishioka ◽  
Yoshio Itoh ◽  
Mitsuru Sugo ◽  
Akio Yamamoto ◽  
Masfumi Yamaguchi
Keyword(s):  
Dislocation Density ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Gaas On Si ◽  
Density Reduction ◽  
Threading Dislocation Density

The Influence of Substrate Patterning on Threading Dislocation Density and Residual Stress in GaAs/Si Heteroepitaxial Layers.

1990 ◽  
Vol 198 ◽  
Author(s):  
Hyunchul Sohn ◽  
Eicke R. Weber ◽  
Jay Tu ◽  
Henry P. Lee ◽  
Shy Wang
Keyword(s):  
Residual Stress ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Etch Pits ◽  
Cross Sectional ◽  
Strained Layers ◽  
Si Substrates ◽  
Growth Area ◽  
Threading Dislocation Density ◽  
Influence Of Substrate

ABSTRACTThe growth of GaAs films by MBE on mesa-type patterned Si substrates has been investigated. Mesa widths were varied from 10 µm to 200 µm and were prepared using chemical etching with Si3N4 masks and reactive ion etching. The residual stress in the epitaxial layer was estimated using low temperature (7K) photoluminescence and the defect distribution was studied by cross sectional TEM, dislocation densities were in addition determined by etch pits. The residual stress and the dislocation density decreased monotonically with the reduction of growth area. By the incorporation of strained layers with the reduction of growth area, the etch pit density in GaAs layers on mesas was reduced further.

scholarly journals Modeling of Threading Dislocation Density Reduction in Porous III-Nitride Layers

2015 ◽  
Vol 44 (5) ◽  
pp. 1287-1292 ◽  
Author(s):  
Dmitry M. Artemiev ◽  
Tatiana S. Orlova ◽  
Vladislav E. Bougrov ◽  
Maxim A. Odnoblyudov ◽  
Alexei E. Romanov
Keyword(s):  
Dislocation Density ◽  
Threading Dislocation ◽  
Density Reduction ◽  
Threading Dislocation Density ◽  
Nitride Layers

The Reduction of The Defect Density in CdTe Buffer Layers for The Growth of HgCdTe Infrared Photodiodes on Si (211) Substrates

1997 ◽  
Vol 484 ◽  
Author(s):  
H.-Y. Wei ◽  
L. Salamanca-Riba ◽  
N. K. Dhar
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Three Dimensional ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Migration Enhanced Epitaxy ◽  
Threading Dislocation Density ◽  
Order Of Magnitude ◽  
Cdte Buffer

CdTe epilayers were grown by molecular beam epitaxy on As-passivated nominal (211) Si substrates using thin interfacial ZnTe layers. By using thin recrystallized (initially amorphous) ZnTe buffei layers, we utilized migration enhanced epitaxy (MEE) in the ZnTe layer and overcome the tendency toward three dimensional nucleation. The threading dislocation densities in 8–9 tm thick CdTe films deposited on the recrystallized amorphous ZnTe films were in the range of 2 to 5 × 105 cm−2. In addition to the reduction of threading dislocation density, the interface between the ZnTe layers and the Si substrate is much smoother and the microtwin density is an order of magnitude lower than in regular MEE growth. In order to understand the initial nucleation mechanism of the ZnTe on the As precursor Si surface, we also grew ZnTe epilayers on Te precursor treated Si substrates. The growth mode, microtwin density, and threading dislocation density are compared for films grown on Si substrates with different surface precursors and grown by different growth methods.

Multistep method for threading dislocation density reduction in MOCVD grown GaN epilayers

2006 ◽  
Vol 203 (10) ◽  
pp. R76-R78 ◽  
Author(s):  
T. Lang ◽  
M. A. Odnoblyudov ◽  
V. E. Bougrov ◽  
A. E. Romanov ◽  
S. Suihkonen ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Multistep Method ◽  
Threading Dislocation ◽  
Density Reduction ◽  
Threading Dislocation Density
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