Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
2004 ◽
Vol 43
(4B)
◽
pp. 2271-2276
◽
Keyword(s):
2002 ◽
Vol 41
(Part 1, No. 4B)
◽
pp. 2367-2373
◽
Keyword(s):
Keyword(s):
2003 ◽
Vol 42
(Part 1, No. 4B)
◽
pp. 2462-2467
◽
Advanced transfer system for spin coating film transfer and hot-pressing in planarization technology
2002 ◽
Vol 20
(3)
◽
pp. 797
◽
2008 ◽
Vol 47
(1)
◽
pp. 113-118
◽
2013 ◽
Vol 63
(2)
◽
pp. 246-250
◽