Current Status and Future Prospects of GaN HEMTs for High Power and High Frequency Applications

2013 ◽  
Vol 50 (3) ◽  
pp. 323-332 ◽  
Author(s):  
T. Kikkawa ◽  
M. Kanamura ◽  
T. Ohki ◽  
K. Imanishi ◽  
K. Watanabe ◽  
...  
Author(s):  
Junji Kotani ◽  
Shiro Ozaki ◽  
Junya Yaita ◽  
Atsushi Yamada ◽  
Toshihiro Ohki

2009 ◽  
Vol 193 ◽  
pp. 012040 ◽  
Author(s):  
F A Marino ◽  
N Faralli ◽  
D K Ferry ◽  
S M Goodnick ◽  
M Saraniti

2013 ◽  
Vol 8 (2) ◽  
pp. 78-82
Author(s):  
B. Padmanabhan ◽  
D. Vasileska ◽  
S. M. Goodnick

Current collapse phenomenon that occurs in GaN HEMTs under a moderately large DC bias stress, poses serious problems for usage of GaN technology in high-power high-frequency applications from a reliability standpoint. Additional problem in these devices operated at high biases is the appearance of self-heating effects that degrade device characteristics and, as shown in this work further amplify the problem of current collapse by changing the device electrostatics.


2008 ◽  
Vol 1108 ◽  
Author(s):  
Shigeru Nakajima ◽  
Yasunori Tateno ◽  
Seigo Sano

AbstractThis paper is overviewed the recent progress on GaN HEMTs. High power, high frequency and high efficiency performance are reported. In addition, the results about long-term reliabilities and good manufacturability demonstrate that GaN HEMTs are ready for mass production.


2002 ◽  
Vol 194 (2) ◽  
pp. 433-438 ◽  
Author(s):  
L.F. Eastman ◽  
V. Tilak ◽  
V. Kaper ◽  
J. Smart ◽  
R. Thompson ◽  
...  
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