Reliability Concerns due to Self-Heating effects in GaN HEMTs
Keyword(s):
Dc Bias
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Current collapse phenomenon that occurs in GaN HEMTs under a moderately large DC bias stress, poses serious problems for usage of GaN technology in high-power high-frequency applications from a reliability standpoint. Additional problem in these devices operated at high biases is the appearance of self-heating effects that degrade device characteristics and, as shown in this work further amplify the problem of current collapse by changing the device electrostatics.
2009 ◽
Vol 193
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pp. 012040
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2020 ◽
Vol 10
(2)
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pp. 1791
Keyword(s):
2003 ◽
Vol 50
(10)
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pp. 2015-2020
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2001 ◽
Vol 49
(12)
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pp. 2413-2420
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2010 ◽
Vol 54
(4)
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pp. 378-381
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