The Electrodeposition of Nickel-Iron-Phosphorus Thin Films for Computer Memory Use

1964 ◽  
Vol 111 (1) ◽  
pp. 35 ◽  
Author(s):  
W. O. Freitag ◽  
J. S. Mathias ◽  
G. DiGuilio
1987 ◽  
Vol 36 (9) ◽  
pp. 515-519 ◽  
Author(s):  
Fusao SHIRATO ◽  
Yoshiaki OKAJIMA ◽  
Tadafumi KUROISHI ◽  
Yoshinori TAKATA

Nanoscale ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 426-430 ◽  
Author(s):  
Anqi Wang ◽  
Zhonglong Zhao ◽  
Di Hu ◽  
Junfeng Niu ◽  
Man Zhang ◽  
...  

We report that one can gain active control of the electrocatalytic oxygen evolution reaction (OER) on Ni3Fe thin films via externally applied strains.


2010 ◽  
Vol 97-101 ◽  
pp. 1360-1363 ◽  
Author(s):  
Yusrini Marita ◽  
Iskandar Idris Yaacob

Nickel-iron-silicon nitride nanocomposite thin films were prepared by electrodeposition technique. The deposition was performed at current density of 11.5 A dm-2. Nano-size silicon nitride was mixed in the electrolyte bath as dispersed phase. The effects of silicon nitride nanoparticulates in the nickel-iron nanocomposite thin films were investigated in relation to the amount of silicon nitride in the plating bath. X-ray diffraction (XRD) analysis showed that the deposited nickel iron film has face-centered cubic structure (FCC). However, a mixture of body-centered cubic (BCC) and face-centered cubic (FCC) phases were observed for nickel iron-silicon nitride nanocomposite films. The crystallite size of Ni-Fe nanocomposite coating decreased with increasing amount of silicon nitride in the film. From elemental mapping procedure, Si3N4 nanopaticles were uniformly distributed in the Ni-Fe film. The presence of silicon nitride increased the hardness of the film. The microhardness of the nickel-iron nanocomposite increased from 495 HV for nickel-iron film to 846 HV for nickel-iron nanocomposite film with 2 at. % Si. The coercivity of Ni-Fe nanaocomposite films increases with decreasing crystallite size.


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