Synthesis and Characterization of Nickel-Iron-Silicon Nitride Nanocomposite

2010 ◽  
Vol 97-101 ◽  
pp. 1360-1363 ◽  
Author(s):  
Yusrini Marita ◽  
Iskandar Idris Yaacob

Nickel-iron-silicon nitride nanocomposite thin films were prepared by electrodeposition technique. The deposition was performed at current density of 11.5 A dm-2. Nano-size silicon nitride was mixed in the electrolyte bath as dispersed phase. The effects of silicon nitride nanoparticulates in the nickel-iron nanocomposite thin films were investigated in relation to the amount of silicon nitride in the plating bath. X-ray diffraction (XRD) analysis showed that the deposited nickel iron film has face-centered cubic structure (FCC). However, a mixture of body-centered cubic (BCC) and face-centered cubic (FCC) phases were observed for nickel iron-silicon nitride nanocomposite films. The crystallite size of Ni-Fe nanocomposite coating decreased with increasing amount of silicon nitride in the film. From elemental mapping procedure, Si3N4 nanopaticles were uniformly distributed in the Ni-Fe film. The presence of silicon nitride increased the hardness of the film. The microhardness of the nickel-iron nanocomposite increased from 495 HV for nickel-iron film to 846 HV for nickel-iron nanocomposite film with 2 at. % Si. The coercivity of Ni-Fe nanaocomposite films increases with decreasing crystallite size.

2013 ◽  
Vol 647 ◽  
pp. 705-710 ◽  
Author(s):  
Marita Yusrini ◽  
Yaacob Iskandar Idris

Nickel-iron-silicon nitride nanocomposite coatings were prepared by electrodeposition technique. The deposition was performed at current density of 11.5 A dm-2. Nano-size silicon nitride was mixed in the electrolyte bath as dispersed phase. The effects of silicon nitride nanoparticulates in the nickel-iron nanocomposite coating were investigated in relation to the concentration of silicon nitride in the plating bath. X-ray diffraction (XRD) analysis showed that the deposited nickel iron alloy coating has face-centered cubic structure (FCC). However, a mixture of body-centered cubic (BCC) and face-centered cubic (FCC) phases were observed for nickel iron-silicon nitride nanocomposite coatings. . The change of crystal structure to FCC + BCC is due to the higher Fe content in the deposit. The crystallite size of Ni-Fe nanocomposite coating decreased with increasing concentration of silicon nitride in the coating. An increase of silicone nitride in electrolyte solution leads to the increase in surface roughness of the nickel-iron-silicon nitride nanocomposite.


2020 ◽  
Vol 2020 ◽  
pp. 1-9
Author(s):  
Tizazu Abza ◽  
Dereje Gelanu Dadi ◽  
Fekadu Gashaw Hone ◽  
Tesfaye Chebelew Meharu ◽  
Gebremeskel Tekle ◽  
...  

Cobalt sulfide thin films were synthesized from acidic chemical baths by varying the deposition time. The powder X-ray diffraction studies indicated that there are hexagonal CoS, face-centered cubic Co3S4, and cubic Co9S8 phases of cobalt sulfide. The crystallite size of the hexagonal CoS phase decreased from 52.8 nm to 22.5 nm and that of the cubic Co9S8 phase increased from 11 nm to 60 nm as the deposition time increased from 2 hrs to 3.5 hrs. The scanning electron microscopic images revealed crack and pinhole free thin films with uniform and smooth background and few large polygonal grains on the surface. The band gap of the cobalt sulfide thin films decreased from 1.75 eV to 1.3 eV as the deposition time increased from 2 hrs to 3.5 hrs. The photoluminescence (PL) spectra of the films confirmed the emission of ultraviolet, violet, and blue lights. The intense PL emission of violet light at 384 nm had red shifted with increasing deposition time that could be resulted from the increase in the average crystallite size. The FTIR spectra of the films indicated the presence of OH, C-O-H, C-O, double sulfide, and Co-S groups. As the deposition time increased, the electrical resistivity of the cobalt sulfide thin films decreased due to the increase in both the crystallite size and the films’ thickness.


2012 ◽  
Vol 18-19 ◽  
pp. 201-211 ◽  
Author(s):  
L. Cunha ◽  
C. Moura

Chromium nitride and silicon doped chromium nitride thin films have been deposited by r.f. reactive magnetron sputtering. The effect of processing parameters on the properties of chromium nitride films and the correspondent influence of the addition of silicon on the chromium nitride matrix in the films structure and mechanical properties have been investigated. The characterization of the coatings was performed by X-ray diffraction (XRD), and nano-indentation experiments. These studies allow analyzing the crystalline phases, crystal orientation/texture, crystallite size, mechanical properties and the relations between the characteristics of the films. The increase of the nitrogen partial pressure in the working atmosphere produces changes from a body-centered cubic (bcc) Cr structure, to hexagonal Cr2N to face-centered cubic (fcc) CrN structure, with CrN (111) preferred orientation. For the films with a dominant Cr2N phase the hardness has a relative maximum (42 GPa). The highest hardness was measured for a coating with dominant CrN phase (45 GPa) with a crystallite size around 18 nm. The addition of Si, in the films with CrN dominant phase, maintains the CrN (111) preferred orientation and produced variable changes in films hardness, depending on deposition conditions.


2021 ◽  
Vol 7 (3) ◽  
pp. 38
Author(s):  
Roshni Yadav ◽  
Chun-Hsien Wu ◽  
I-Fen Huang ◽  
Xu Li ◽  
Te-Ho Wu ◽  
...  

In this study, [Co/Ni]2/PtMn thin films with different PtMn thicknesses (2.7 to 32.4 nm) were prepared on Si/SiO2 substrates. The post-deposition perpendicular magnetic field annealing (MFA) processes were carried out to modify the structures and magnetic properties. The MFA process also induced strong interlayer diffusion, rendering a less sharp interface between Co and Ni and PtMn layers. The transmission electron microscopy (TEM) lattice image analysis has shown that the films consisted of face-centered tetragonal (fct) PtMn (ordered by MFA), body-centered cubic (bcc) NiMn (due to intermixing), in addition to face-centered cubic (fcc) Co, Ni, and PtMn phases. The peak shift (2-theta from 39.9° to 40.3°) in X-ray diffraction spectra also confirmed the structural transition from fcc PtMn to fct PtMn after MFA, in agreement with those obtained by lattice images in TEM. The interdiffusion induced by MFA was also evidenced by the depth profile of X-ray photoelectron spectroscopy (XPS). Further, the magnetic properties measured by vibrating sample magnetometry (VSM) have shown an increased coercivity in MFA-treated samples. This is attributed to the presence of ordered fct PtMn, and NiMn phases exchange coupled to the ferromagnetic [Co/Ni]2 layers. The vertical shift (Mshift = −0.03 memu) of the hysteresis loops is ascribed to the pinned spins resulting from perpendicular MFA processes.


2014 ◽  
Vol 911 ◽  
pp. 131-135 ◽  
Author(s):  
H. Abdullah ◽  
Noor Azwen Noor Azmy ◽  
Norshafadzila Mohammad Naim ◽  
Aisyah Bolhan ◽  
Aidil Abdul Hamid ◽  
...  

Polymers are excellent host materials for nanoparticles of metals and semiconductors. PVAAgCu nanocomposite was synthesized from chemical reduction, whereas PANIAgCu nanocomposite was synthesized by chemical oxidative polymerization. PVAAgCu and PANIAgCu thin films were deposited on the glass substrate by spin coating technique. The films were characterized by using XRD and AFM. The sensitivity of the samples was analyzed by IV measurement. The peaks in XRD patterns confirm the presence of Ag-Cu nanoparticles in face centered cubic structure. AFM images show the roughness of PVAAgCu and PANIAgCu increased as Ag concentration decreased and Cu concentration increased. I-V measurements indicate that the change in the current of the films increases with the presence of E. coli. The sensitivity on E. coli increases for PVAAgCu and PANIAgCu thin films with high concentration of Cu.


2020 ◽  
Vol 512 ◽  
pp. 167013
Author(s):  
Yu Miao ◽  
Xiaorui Chen ◽  
Shuanglong Yang ◽  
Kun Zheng ◽  
Zhongyuan Lian ◽  
...  

2020 ◽  
Vol 979 ◽  
pp. 180-184
Author(s):  
I. Karuppusamy ◽  
K. Ramachandran ◽  
S. Karuppuchamy

The CuI thin film has been successfully prepared by using cathodic electrodeposition method. The synthesized film was characterized using advanced techniques such as XRD, SEM-EDX and UV measurements. The films are crystallized in face centered cubic structure. The crystallinity is increasing for the applied potential of-0.3 V and the crystallinity deteriorates on increasing the potential above - 0.3 V. It was also observed that the applied voltage plays an important role. Homogeneously distributed triangular faceted morphology was observed from SEM. This is consistent with the result of XRD that electrodeposited CuI thin films grow preferential orientation along the (111) crystal plane.


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