150 mm InP-to-Silicon Direct Wafer Bonding for Silicon Photonic Integrated Circuits

2008 ◽  
Keyword(s):  
Integrated Circuits ◽  
Wafer Bonding ◽  
Photonic Integrated Circuits ◽  
Silicon Photonic ◽  
Direct Wafer Bonding

150 mm InP-to-Silicon Direct Wafer Bonding for Silicon Photonic Integrated Circuits

2019 ◽  
Vol 16 (8) ◽  
pp. 235-241 ◽  
Author(s):  
Di Liang ◽  
Alexander Fang ◽  
Douglas Oakley ◽  
Antonio Napoleone ◽  
David Chapman ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Wafer Bonding ◽  
Photonic Integrated Circuits ◽  
Silicon Photonic ◽  
Direct Wafer Bonding

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

2008 ◽  
Vol 37 (10) ◽  
pp. 1552-1559 ◽  
Author(s):  
Di Liang ◽  
Alexander W. Fang ◽  
Hyundai Park ◽  
Tom E. Reynolds ◽  
Keith Warner ◽  
...  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Wafer Bonding ◽  
Photonic Integrated Circuits ◽  
Compound Semiconductors ◽  
Silicon Photonic

Scalable Ultra-Wideband Pulse Generation Based on Silicon Photonic Integrated Circuits

2017 ◽  
Vol 29 (21) ◽  
pp. 1896-1899 ◽  
Author(s):  
Xinru Wu ◽  
Ke Xu ◽  
Wen Zhou ◽  
Chi Wai Chow ◽  
Hon Ki Tsang
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Pulse Generation ◽  
Ultra Wideband ◽  
Silicon Photonic

A Comparative Study for the Backside Illumination (BSI) Technology Using Bonding Wafer Cleaning Process for Advanced CMOS Image Sensor

2012 ◽  
Vol 195 ◽  
pp. 75-78
Author(s):  
Chung Kyung Jung ◽  
Sung Wook Joo ◽  
Seoung Hun Jeong ◽  
Sang Wook Ryu ◽  
Han Choon Lee ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Comparative Study ◽  
Quantum Efficiency ◽  
Wafer Bonding ◽  
Image Sensor ◽  
Silicon On Insulator ◽  
Cleaning Process ◽  
Electrochemical Systems ◽  
Wafer Cleaning ◽  
Direct Wafer Bonding

Over the last decades, the concept of backside illumination (BSI) sensors has become one of the leading solutions to optical challenges such as improved quantum efficiency (QE), and cross-talk, respectively [1-. Direct wafer bonding is a method for fabricating advanced substrates for micro-electrochemical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer.

scholarly journals Strain-engineered high-responsivity MoTe2 photodetector for silicon photonic integrated circuits

2020 ◽  
Vol 14 (9) ◽  
pp. 578-584 ◽  
Author(s):  
R. Maiti ◽  
C. Patil ◽  
M. A. S. R. Saadi ◽  
T. Xie ◽  
J. G. Azadani ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
High Responsivity ◽  
Silicon Photonic
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