Novel Techniques For Characterization Of Fast-Cure Anisotropic Conductive And Non-Conductive Adhesives

Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396645 ◽

2005 ◽

Cited By ~ 2

Author(s):

C. Lee ◽

A. Yeo

Keyword(s):

Conductive Adhesives ◽

Moisture Conditions

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Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280099 ◽

2006 ◽

Cited By ~ 3

Author(s):

Tomasz Falat ◽

Jan Felba ◽

Artur Wymylowski ◽

B. Jansen ◽

John Nakka

Keyword(s):

Polymer Matrix ◽

Conductive Adhesives ◽

Thermally Conductive

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Development and characterization of graphene-enhanced thermal conductive adhesives

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922700 ◽

2014 ◽

Cited By ~ 4

Author(s):

Marcello Casa ◽

Shirong Huang ◽

Paolo Ciambelli ◽

Nan Wang ◽

Lilei Ye ◽

...

Keyword(s):

Conductive Adhesives

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Development and characterization of graphene enhanced thermal conductive adhesives

2016 6th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2016.7764682 ◽

2016 ◽

Cited By ~ 2

Author(s):

Nan Wang ◽

Nikolaos Logothetis ◽

Mu Wei ◽

Shirong Huang ◽

Lilei Ye ◽

...

Keyword(s):

Conductive Adhesives

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Characterization of Electrically Conductive Adhesives

Energy Procedia ◽

10.1016/j.egypro.2012.07.128 ◽

2012 ◽

Vol 27 ◽

pp. 676-679 ◽

Cited By ~ 14

Author(s):

U. Eitner ◽

T. Geipel ◽

S.-N. Holtschke ◽

M. Tranitz

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Characterization of silver flakes utilized for isotropic conductive adhesives

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757280 ◽

2003 ◽

Cited By ~ 9

Author(s):

D.L. Markley ◽

Q.K. Tong ◽

D.J. Magliocca ◽

T.D. Hahn

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Silver Flakes

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Numerical approach to characterization of thermally conductive adhesives

Microelectronics Reliability ◽

10.1016/j.microrel.2006.02.019 ◽

2007 ◽

Vol 47 (2-3) ◽

pp. 342-346 ◽

Cited By ~ 9

Author(s):

Tomasz Fałat ◽

Artur Wymysłowski ◽

Jana Kolbe

Keyword(s):

Numerical Approach ◽

Conductive Adhesives ◽

Thermally Conductive

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Characterization of Fast Cure Anisotropic Conductive and Non-Conductive Adhesives

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430571 ◽

2006 ◽

Author(s):

Mary Teo ◽

Charles Lee

Keyword(s):

Conductive Adhesives

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Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules

Progress in Photovoltaics Research and Applications ◽

10.1002/pip.3257 ◽

2020 ◽

Vol 28 (7) ◽

pp. 659-681 ◽

Cited By ~ 5

Author(s):

Martin Springer ◽

Nick Bosco

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives ◽

Photovoltaic Modules ◽

Linear Viscoelastic

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Characterization of non-conductive adhesives

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502851 ◽

2005 ◽

Author(s):

D. Farley ◽

A. Dasgupta ◽

J.F.J.M. Caers ◽

Wong Ee Hua

Keyword(s):

Conductive Adhesives

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