Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

2005 ◽

Cited By ~ 3

Author(s):

F.X. Che ◽

J.H.L. Pang

Keyword(s):

Solder Joint ◽

Accelerated Life Test ◽

Life Test ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Accelerated Life

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Flow analysis for flip chip underfilling process using characteristic based split method

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396681 ◽

2005 ◽

Author(s):

V.M. Kulkarni ◽

K.N. Seetharmu ◽

P.A. Aswatha Narayana ◽

I.A. Azid ◽

G.A. Quadir

Keyword(s):

Flip Chip ◽

Flow Analysis ◽

Split Method ◽

Characteristic Based Split

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Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396684 ◽

2005 ◽

Cited By ~ 2

Author(s):

Xueren Zhang ◽

Tong Yan Tee ◽

Hun Shen Ng ◽

J. Teysseyre ◽

S. Loo ◽

...

Keyword(s):

Flip Chip ◽

Mechanical Modeling ◽

Wire Bond

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Coaxial probe dielectric measurements in the presence of airgaps

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396658 ◽

2005 ◽

Author(s):

A.P. Popov ◽

M.D. Rotaru

Keyword(s):

Dielectric Measurements ◽

Coaxial Probe

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Pressure and depth dependence of sidewall roughness of polymer optical waveguides during reactive ion etching

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396638 ◽

2005 ◽

Author(s):

S.K. Pani ◽

C.C. Wong ◽

C.S. Premachandran ◽

M.K. Iyer ◽

P.V. Ramana ◽

...

Keyword(s):

Optical Waveguides ◽

Reactive Ion Etching ◽

Sidewall Roughness ◽

Ion Etching ◽

Depth Dependence

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Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396662 ◽

2005 ◽

Cited By ~ 1

Author(s):

Lim Ying Ying ◽

M.D. Rotaru ◽

A. Alphones ◽

A.P. Popov ◽

R. Rajoo

Keyword(s):

Coaxial Line ◽

Packaging Materials ◽

Dielectric Parameters ◽

Fast Extraction

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A new approach to low-temperature bonding for fine pitch chip-on-flex technology

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396646 ◽

2005 ◽

Author(s):

Su-Tsai Lu

Keyword(s):

Low Temperature ◽

New Approach ◽

Fine Pitch ◽

Low Temperature Bonding

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Structural optimization of fine pitch, large die flip chip package

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396586 ◽

2005 ◽

Cited By ~ 2

Author(s):

A.G.K. Viswanath ◽

Wang Fang ◽

Tai-Chong Chai ◽

Navas Khan ◽

S. Sampath

Keyword(s):

Structural Optimization ◽

Flip Chip ◽

Fine Pitch

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Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396648 ◽

2005 ◽

Cited By ~ 3

Author(s):

Z.P. Xiong ◽

Ho Pei Sze ◽

K.H. Chua

Keyword(s):

Flip Chip ◽

Solder Bump

Download Full-text

Thermal management and characterization of flip chip BGA packages

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396576 ◽

2005 ◽

Cited By ~ 5

Author(s):

S. Krishnamoorthi ◽

D.Y.R. Chong ◽

A.Y.S. Sun

Keyword(s):

Thermal Management ◽

Flip Chip ◽

Bga Packages

Download Full-text

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)

Flow analysis for flip chip underfilling process using characteristic based split method

Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Coaxial probe dielectric measurements in the presence of airgaps

Pressure and depth dependence of sidewall roughness of polymer optical waveguides during reactive ion etching

Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique

A new approach to low-temperature bonding for fine pitch chip-on-flex technology

Structural optimization of fine pitch, large die flip chip package

Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad

Thermal management and characterization of flip chip BGA packages

Export Citation Format

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)

Flow analysis for flip chip underfilling process using characteristic based split method

Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

Coaxial probe dielectric measurements in the presence of airgaps

Pressure and depth dependence of sidewall roughness of polymer optical waveguides during reactive ion etching

Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique

A new approach to low-temperature bonding for fine pitch chip-on-flex technology

Structural optimization of fine pitch, large die flip chip package

Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad

Thermal management and characterization of flip chip BGA packages

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
Latest Publications