2016 6th Electronic System-Integration Technology Conference (ESTC)
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146
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Published By IEEE

9781509014026
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design of a GaN HEMT based inverter leg power module for aeronautic applications

2016 ◽  
Author(s):  
Benoit Thollin ◽  
Fadi Zaki ◽  
Zoubir Khatir ◽  
Regis Meuret ◽  
Donatien Martineau ◽  
...  
Keyword(s):  
Power Module ◽  
Gan Hemt

Production and measurement of large-area moisture barriers for electronic applications

2016 ◽  
Author(s):  
David Bird ◽  
Andrew Cook ◽  
Paolo Melgari ◽  
David Robbins ◽  
Phil Hollis ◽  
...  
Keyword(s):  
Large Area ◽  
Moisture Barriers

Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections

2016 ◽  
Author(s):  
Mark W. Sugden ◽  
Junlei Tao ◽  
Changqing Liu ◽  
David A. Hutt ◽  
David C. Whalley ◽  
...  
Keyword(s):  
Fine Pitch ◽  
Core Particles

A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems

2016 ◽  
Author(s):  
Hermann Oppermann ◽  
Morten Brink ◽  
Oswin Ehrmann ◽  
Stefan Groetsch ◽  
Andreas Plossl ◽  
...  
Keyword(s):  
Front Lighting ◽  
Bond Interface ◽  
Lighting Systems

scholarly journals Technology optimization for high bandwidth density applications on 3D interposer

2016 ◽  
Author(s):  
Nicolas Pantano ◽  
Cesar Roda Neve ◽  
Geert Van der Plas ◽  
Mikael Detalle ◽  
Marian Verhelst ◽  
...  
Keyword(s):  
High Bandwidth

Ensuring system reliability of a piezoelectric energy harvester

2016 ◽  
Author(s):  
Olaf Wittler ◽  
Ole Holck ◽  
Stephan Benecke ◽  
Tom Dobs ◽  
Marius van Dijk ◽  
...  
Keyword(s):  
System Reliability ◽  
Energy Harvester ◽  
Piezoelectric Energy

Bonding process using microscale Ag particle paste for die attach

2016 ◽  
Author(s):  
H. Nishikawa ◽  
X. Liu ◽  
X. Wang ◽  
A. Fujita ◽  
N. Kamada ◽  
...  
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Ag Particle
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