The Effect of Ultrasonic Cleaning Methods on Rubber Base Impression Materials

1978 ◽  
Vol 57 (9-10) ◽  
pp. 939-939 ◽  
Author(s):  
Lewis Lorton ◽  
R.W. Phillips ◽  
M.L. Swartz
2017 ◽  
Vol 39 (1) ◽  
pp. 58-63 ◽  
Author(s):  
Tamara Carolina de Camargo ◽  
Alda Graciele Claudio dos Santos Almeida ◽  
Camila Quartim de Moraes Bruna ◽  
Caroline Lopes Ciofi-Silva ◽  
Flávia Morais Gomes Pinto ◽  
...  

OBJECTIVETo compare the effectiveness of manual and automated methods for cleaning laparoscopic instruments.DESIGNExperimental laboratory study.METHODSWe evaluated 4 methods of cleaning laparoscopic instruments: (1) manual-only cleaning and rinsing with potable tap water; (2) manual cleaning and rinsing with potable tap water, followed by ultrasonic cleaning without rinsing; (3) manual cleaning and rinsing with potable tap water followed by ultrasonic cleaning and rinsing with potable tap water; and (4) manual cleaning and rinsing with potable tap water, followed by ultrasonic cleaning and rinsing: first with potable tap water and then with sterile distilled water. Organic residues of protein, hemoglobin, and carbohydrates were evaluated using spectrophotometry.RESULTSThe various cleaning methods tested did not result in statistically significant differences (P>.05) in the levels of investigated organic residues.CONCLUSIONSAll cleaning and rinsing methods tested were found to be effective in reducing the levels of organic residues on laparoscopic instruments. Thus, there is no advantage gained by supplementing manual-only cleaning with automated ultrasonic cleaning, nor was there a difference between rinsing with potable tap versus sterile distilled water.Infect Control Hosp Epidemiol 2018;39:58–63


Processes ◽  
2021 ◽  
Vol 9 (4) ◽  
pp. 585
Author(s):  
Jon Ander Sarasua Miranda ◽  
Leire Ruiz-Rubio ◽  
Estibaliz Aranzabe Basterrechea ◽  
Jose Luis Vilas-Vilela

Ultrasonic cleaning is a developed and widespread technology used in the cleaning industry. The key to its success over other cleaning methods lies in its capacity to penetrate seemingly inaccessible, hard-to-reach corners, cleaning them successfully. However, its major drawback is the need to immerse the product into a tank, making it impossible to work with large or anchored elements. With the aim of revealing the scope of the technology, this paper will attempt to describe a more innovative approach to cleaning large area surfaces (walls, floors, façades, etc.) which involves applying ultrasonic cavitation onto a thin film of water, which is then deposited onto a dirty surface. Ultrasonic cleaning is an example of the proliferation of green technology, requiring 15 times less water and 115 times less power than conventional high-pressurized waterjet cleaning mechanisms. This paper will account for the physical phenomena that govern this new cleaning mechanism and the competition it poses towards more conventional pressurized waterjet technology. Being easy to use as a measure of success, specular surface cleaning has been selected to measure the degree of cleanliness (reflectance) as a function of the process’s parameters. A design of experiments has been developed in line with the main process parameters: amplitude, gap, and sweeping speed. Regression models have also been used to interpret the results for different degrees of soiling. The work concludes with the finding that the proposed new cleaning technology and process can reach up to 98% total cleanliness, without the use of any chemical product and with very low water and power consumption.


Author(s):  
C.M. Sung ◽  
M. Levinson ◽  
M. Tabasky ◽  
K. Ostreicher ◽  
B.M. Ditchek

Directionally solidified Si/TaSi2 eutectic composites for the development of electronic devices (e.g. photodiodes and field-emission cathodes) were made using a Czochralski growth technique. High quality epitaxial growth of silicon on the eutectic composite substrates requires a clean silicon substrate surface prior to the growth process. Hence a preepitaxial surface cleaning step is highly desirable. The purpose of this paper is to investigate the effect of surface cleaning methods on the epilayer/substrate interface and the characterization of silicon epilayers grown on Si/TaSi2 substrates by TEM.Wafers were cut normal to the <111> growth axis of the silicon matrix from an approximately 1 cm diameter Si/TaSi2 composite boule. Four pre-treatments were employed to remove native oxide and other contaminants: 1) No treatment, 2) HF only; 3) HC1 only; and 4) both HF and HCl. The cross-sectional specimens for TEM study were prepared by cutting the bulk sample into sheets perpendicular to the TaSi2 fiber axes. The material was then prepared in the usual manner to produce samples having a thickness of 10μm. The final step was ion milling in Ar+ until breakthrough occurred. The TEM samples were then analyzed at 120 keV using the Philips EM400T.


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