Effect of Exfiltration on the Hygrothermal Behaviour of a Residential Wall Assembly

1996 ◽  
Vol 19 (3) ◽  
pp. 215-227 ◽  
Author(s):  
Tuomo Ojanen ◽  
Kumar Kumaran
1998 ◽  
Vol 4 (6) ◽  
pp. 99-102
Author(s):  
Yumiko SAWADA ◽  
Masashi YOSHIDA ◽  
Tsutomu NAGAOKA ◽  
Shintaro MICHIKOSHI ◽  
Nagao HORI

2021 ◽  
pp. 174425912098876
Author(s):  
Maurice Defo ◽  
Michael Lacasse ◽  
Abdelaziz Laouadi

The objective of this work was to compare the hygrothermal responses and the moisture performance of four wood-frame walls as predicted by four hygrothermal (HAM) simulation tools, namely: DELPHIN, WUFI, hygIRC and COMSOL. The four wall systems differ only in their cladding type; these were fibreboard, vinyl, stucco and brick. Three Canadian cities having different climates were selected for simulations: Ottawa, Ontario; Vancouver, British Columbia and Calgary, Alberta. In each city, simulations were run for 2 years. Temperature and relative humidity of the outer layer of OSB sheathing were compared amongst the four simulation tools. The mould growth index on the outer layer of the OSB sheathing was used to compare the moisture performance predicted by the respective hygrothermal simulation tools. Temperature profiles of the outer layer of the OSB sheathing were all in good agreement for the four HAM tools in the three locations. For relative humidity, the highest discrepancies amongst the four tools were found with stucco cladding where differences as high as 20% could be found from time to time. Mould growth indices predicted by the four HAM tools were similar in some cases but different in other cases. The discrepancies amongst the different HAM tools were likely related to: the material property processing, how the quantity of wind-driven rain absorbed at the cladding surface is computed and some implementation details. Despite these discrepancies, The tools generally yielded consistent results and could be used for comparing the impacts of different designs on the risk of premature deterioration, as well as for evaluating the relative effects of climate change on a given wall assembly design.


2020 ◽  
pp. 174425912098003
Author(s):  
Travis V Moore ◽  
Cynthia A. Cruickshank ◽  
Ian Beausoleil-Morrison ◽  
Michael Lacasse

The purpose of this paper is to investigate the potential for calculation methods to determine the thermal resistance of a wall system containing vacuum insulation panels (VIPs) that has been experimentally characterised using a guarded hot box (GHB) apparatus. The VIPs used in the wall assembly have not been characterised separately to the wall assembly, and therefore exact knowledge of the thermal performance of the VIP including edge effect is not known. The calculations and simulations are completed using methods found in literature as well as manufacturer published values for the VIPs to determine the potential for calculation and simulation methods to predict the thermal resistance of the wall assembly without the exact characterisation of the VIP edge effect. The results demonstrate that disregarding the effect of VIP thermal bridges results in overestimating the thermal resistance of the wall assembly in all calculation and simulation methods, ranging from overestimates of 21% to 58%. Accounting for the VIP thermal bridges using the manufacturer advertised effective thermal conductivity of the VIPs resulted in three methods predicting the thermal resistance of the wall assembly within the uncertainty of the GHB results: the isothermal planes method, modified zone method and the 3D simulation. Of these methods only the 3D simulation can be considered a potential valid method for energy code compliance, as the isothermal planes method requires too drastic an assumption to be valid and the modified zone method requires extrapolating the zone factor beyond values which have been validated. The results of this work demonstrate that 3D simulations do show potential for use in lieu of guarded hot box testing for predicting the thermal resistance of wall assemblies containing both VIPs and steel studs. However, knowledge of the VIP effective thermal conductivity is imperative to achieve reasonable results.


Yeast ◽  
2021 ◽  
Author(s):  
Qingguo Guo ◽  
Na Meng ◽  
Guanzhi Fan ◽  
Dong Sun ◽  
Yuan Meng ◽  
...  

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