scholarly journals The failure of the Stava Valley tailings dams (Northern Italy): numerical analysis of the flow dynamics and rheological properties

2017 ◽  
Vol 4 (1) ◽  
Author(s):  
Marina Pirulli ◽  
Monica Barbero ◽  
Maddalena Marchelli ◽  
Claudio Scavia
Keyword(s):  
Numerical Analysis ◽  
Rheological Properties ◽  
Northern Italy ◽  
Flow Dynamics ◽  
Tailings Dams

Numerical analysis of fluid flow dynamics around a yawed half-submerged cylinder inside an open channel

2021 ◽  
Vol 33 (1) ◽  
pp. 111-119
Author(s):  
M. I. Alamayreh ◽  
A. Fenocchi ◽  
G. Petaccia ◽  
S. Sibilla ◽  
E. Persi
Keyword(s):  
Fluid Flow ◽  
Numerical Analysis ◽  
Open Channel ◽  
Flow Dynamics ◽  
Submerged Cylinder

scholarly journals Benchmark Problems on Numerical Analysis for Two-Phase Flow Dynamics. (II). Problems of Difficulty in Analyzing Numerically.

1991 ◽  
Vol 33 (10) ◽  
pp. 939-947
Author(s):  
Masanori ARITOMI ◽  
Masashi HIRANO ◽  
Akihiko MINATO ◽  
Makoto AKAI ◽  
Norio SHIMEGI ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Two Phase Flow ◽  
Flow Dynamics ◽  
Benchmark Problems ◽  
Phase Flow ◽  
Two Phase

Definition of the flow dynamics by numerical analysis in a filterpress reactor

2007 ◽  
Vol 32 (15) ◽  
pp. 3126-3132 ◽  
Author(s):  
Leticia Vázquez Gutiérrez ◽  
Hugo Lara Marcial ◽  
Sandra Figueroa Ramírez ◽  
Alberto Alvarez Gallegos ◽  
Fernando Sierra Espinosa
Keyword(s):  
Numerical Analysis ◽  
Flow Dynamics ◽  
Definition Of

Numerical analysis on the gas flow dynamics from a rectangular slot-nozzle for pulse cleaning of filter unit

2016 ◽  
Vol 297 ◽  
pp. 330-339 ◽  
Author(s):  
Haixia Li ◽  
Joohong Choi ◽  
Bin Li ◽  
Ire Kim ◽  
Jungwon Heo
Keyword(s):  
Numerical Analysis ◽  
Gas Flow ◽  
Flow Dynamics ◽  
Rectangular Slot ◽  
Slot Nozzle ◽  
Filter Unit

Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

2007 ◽  
Vol 124-126 ◽  
pp. 543-546 ◽  
Author(s):  
Koushi Ohta ◽  
Kiyokazu Yasuda ◽  
Michiya Matsushima ◽  
Kozo Fujimoto
Keyword(s):  
Surface Tension ◽  
Numerical Analysis ◽  
Numerical Study ◽  
High Density ◽  
Flow Dynamics ◽  
Conductive Adhesives ◽  
3 Dimensional ◽  
Conductive Path ◽  
Dimensional Flow ◽  
Self Organizing

The growing importance of high integration on electronics demands novel interconnection methods replacing high-cost solder bumping or less reliable conductive adhesives. Self-organizing interconnection process using resin containing solder fillers has a possibility to achieve high-density joints satisfying both needs. Numerical study visualized the process and revealed that surface tension of molten fillers and resin viscosity determine the speed of conductive path formation.

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