544 Numerical Simulation for Micro-scale Flow of Electronic Packaging Process

2006 ◽  
Vol 2006.19 (0) ◽  
pp. 737-738
Author(s):  
Tomohisa Hashimoto ◽  
Shin-ichiro Tanifuji
Keyword(s):  
Numerical Simulation ◽  
Electronic Packaging ◽  
Packaging Process ◽  
Micro Scale

Huff and puff process optimization in micro scale by coupling laboratory experiment and numerical simulation

Fuel ◽  
2018 ◽  
Vol 224 ◽  
pp. 289-301 ◽  
Author(s):  
Damian Janiga ◽  
Robert Czarnota ◽  
Jerzy Stopa ◽  
Paweł Wojnarowski
Keyword(s):  
Numerical Simulation ◽  
Laboratory Experiment ◽  
Process Optimization ◽  
Micro Scale

scholarly journals Modelling of textile composite reinforcements on the micro-scale

2014 ◽  
Vol 14 (1) ◽  
pp. 28-33 ◽  
Author(s):  
Oliver Döbrich ◽  
Thomas Gereke ◽  
Chokri Cherif
Keyword(s):  
Numerical Simulation ◽  
Finite Element Analysis ◽  
Computational Cost ◽  
Textile Composite ◽  
Element Analysis ◽  
Simulation Tools ◽  
Micro Scale ◽  
Generating Method ◽  
Geometrical Effects ◽  
Composite Reinforcements

Abstract Numerical simulation tools are increasingly used for developing novel composites and composite reinforcements. The aim of this paper is the application of digital elements for the simulation of the mechanical behaviour of textile reinforcement structures by means of a finite element analysis. The beneficial computational cost of these elements makes them applicable for the use in large models with a solution on near micro-scale. The representation of multifilament yarn models by a large number of element-chains is highly suitable for the analysis of structural and geometrical effects. In this paper, a unit cell generating method for technical reinforcement textiles, using digital elements for the discretization, is introduced.

Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

2010 ◽  
Vol 20 (9) ◽  
pp. 1707-1711
Author(s):  
Kai-kun WANG ◽  
Fu-yu WANG ◽  
Xue-jun CHEN ◽  
Lu WANG ◽  
Chun-mei MA
Keyword(s):  
Numerical Simulation ◽  
Electronic Packaging

Numerical simulation and experimentation of a novel micro scale laser high speed punching

2010 ◽  
Vol 50 (5) ◽  
pp. 491-494 ◽  
Author(s):  
Huixia Liu ◽  
Zongbao Shen ◽  
Xiao Wang ◽  
Hejun Wang ◽  
Maoke Tao
Keyword(s):  
Numerical Simulation ◽  
High Speed ◽  
Micro Scale

Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height

2020 ◽  
Vol 64 (12) ◽  
pp. 2101-2108
Author(s):  
Limeng Yin ◽  
Cunguo Zuo ◽  
Zhongwen Zhang ◽  
Gang Wang ◽  
Zongxiang Yao ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Solder Joint ◽  
Mechanical Behavior ◽  
Sac305 Solder ◽  
Micro Scale
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