ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)

2002 ◽

Cited By ~ 1

Author(s):

Seok Hwan Moon ◽

Choon Gi Choi ◽

Gunn Hwang ◽

Tae Coo Choy

Keyword(s):

Experimental Study ◽

Heat Pipe

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Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866200 ◽

2002 ◽

Author(s):

Yajun Yin ◽

Qinshan Fan ◽

Bo Wang

Keyword(s):

Lower Bound ◽

Constitutive Model ◽

Porous Materials ◽

Preliminary Examination ◽

Damage Constitutive Model

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Experimental verification of a model for the optimization of pin fin heatsinks

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866809 ◽

2002 ◽

Cited By ~ 1

Author(s):

T. Zapach ◽

T. Newhouse ◽

J. Taylor ◽

P. Thomasing

Keyword(s):

Experimental Verification ◽

Pin Fin

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A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866198 ◽

2002 ◽

Cited By ~ 2

Author(s):

T. Ratanawilai ◽

B. Hunter ◽

G. Subbarayan ◽

D. Rose

Keyword(s):

Moiré Interferometry ◽

Moire Interferometry ◽

Electronic Packages ◽

Strain Gages

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Material properties, geometry and their effect on the fatigue life of two flip-chip models

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866172 ◽

2002 ◽

Cited By ~ 2

Author(s):

Hua Lu ◽

C. Bailey

Keyword(s):

Fatigue Life ◽

Material Properties ◽

Flip Chip

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Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866213 ◽

2002 ◽

Cited By ~ 4

Author(s):

Y. Zhao ◽

C. Basaran ◽

A. Cartwright ◽

T. Dishongh

Keyword(s):

Experimental Observation ◽

Solder Joints ◽

Thermomechanical Behavior

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Component temperature prediction in printed circuit boards with boundary integral method

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866176 ◽

2002 ◽

Author(s):

L.A.W. Bambace ◽

E.C. Garcia ◽

C. Melo

Keyword(s):

Integral Method ◽

Printed Circuit Boards ◽

Boundary Integral ◽

Boundary Integral Method ◽

Circuit Boards ◽

Temperature Prediction ◽

Printed Circuit ◽

Component Temperature

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Development of compact thermal models for advanced electronic packaging: methodology and experimental validation for a single-chip CPGA package

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866829 ◽

2002 ◽

Cited By ~ 10

Author(s):

A. Aranyosi ◽

A. Ortega ◽

J. Evans ◽

T. Tarter ◽

J. Pursel ◽

...

Keyword(s):

Electronic Packaging ◽

Experimental Validation ◽

Single Chip ◽

Thermal Models

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Numerical simulation of interfacial delamination in electronic packaging

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866854 ◽

2002 ◽

Cited By ~ 2

Author(s):

B. Wang ◽

X. Sun ◽

Q.S. Fan ◽

Y. Yin

Keyword(s):

Numerical Simulation ◽

Electronic Packaging ◽

Interfacial Delamination

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Stress/strength and reliability evaluations on UBM in different solder systems

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866191 ◽

2002 ◽

Cited By ~ 5

Author(s):

Y. Guo ◽

Shun-Meen Kuo ◽

L. Mercado

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ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Experimental study on performance of a miniature heat pipe with woven-wired wick

Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials

Experimental verification of a model for the optimization of pin fin heatsinks

A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

Material properties, geometry and their effect on the fatigue life of two flip-chip models

Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

Component temperature prediction in printed circuit boards with boundary integral method

Development of compact thermal models for advanced electronic packaging: methodology and experimental validation for a single-chip CPGA package

Numerical simulation of interfacial delamination in electronic packaging

Stress/strength and reliability evaluations on UBM in different solder systems

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ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Experimental study on performance of a miniature heat pipe with woven-wired wick

Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials

Experimental verification of a model for the optimization of pin fin heatsinks

A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

Material properties, geometry and their effect on the fatigue life of two flip-chip models

Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation

Component temperature prediction in printed circuit boards with boundary integral method

Development of compact thermal models for advanced electronic packaging: methodology and experimental validation for a single-chip CPGA package

Numerical simulation of interfacial delamination in electronic packaging

Stress/strength and reliability evaluations on UBM in different solder systems

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
Latest Publications