Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

2010 ◽  
Vol 20 (9) ◽  
pp. 1707-1711
Author(s):  
Kai-kun WANG ◽  
Fu-yu WANG ◽  
Xue-jun CHEN ◽  
Lu WANG ◽  
Chun-mei MA
2009 ◽  
Vol 00 (00) ◽  
pp. 090904073309027-8
Author(s):  
H.W. Wang ◽  
S. Kyriacos ◽  
L. Cartilier

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