1918 Natural Convection Air Cooling in a Vertical Channel of Electronic Equipment

2007 ◽  
Vol 2007.7 (0) ◽  
pp. 203-204
Author(s):  
Yasushi NISHINO ◽  
Ryoji IMAI ◽  
Shinji NAKAGAWA ◽  
Masaru ISHIZUKA
Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa

The cooling capability in compact electronic equipment in natural convective flow fields has been investigated. The relationship between air passage width in the channel and natural cooling capability was obtained. Temperature and velocity measurements were carried out using a channel model of electronic equipment comprising a vertical duct of rectangular section. The channel model had two copper walls and two transparent acrylic walls. The clearance between the copper walls was used as a parameter for the channel model. Velocity profiles of natural cooling flow in the channel were quantitatively measured using particle image velocimetry (PIV). The temperature and velocity results demonstrated that changes in the velocity profiles closely depend on the wall clearances. It is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling in the channel.


Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa

The natural convection cooling capability in a compact item of electronic equipment was investigated quantitatively by experiment and numerical simulation with a simple channel model. The optimization of the channel sizes, especially the clearance between heated walls, was discussed. The channel model, which consists of a vertical duct of rectangular section, was applied as the experimental model of electronic equipment in this study. The channel model consists of two heated copper walls and two transparent acrylic walls. The clearance between the copper walls of the channel was varied from 5 mm to 15 mm. Temperature measurement on the copper wall surfaces and velocity measurement of natural air flow in the channel by using a particle image velocimetry (PIV) were conducted for a few clearances of the channel. Numerical simulation was also carried out, with a model following the experimental setup, for more detailed discussion of various clearances of the channel. The relationship between the clearance and the temperature rise of the walls or velocity profile was investigated. The correlation between the Rayleigh number and the Nusselt number was obtained from measured temperature. The natural cooling capability and the velocity profiles depend on the clearance between the copper walls. When the wall clearances are more than 15 mm, the cooling is not enhanced. On the other hand, in the case that the clearance becomes less than 7 mm, the cooling capability becomes significantly lower. Consequently, it is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling from the view point of the space and the capability.


2009 ◽  
Vol 2009.6 (0) ◽  
pp. 83-84
Author(s):  
Yasushi NISHINO ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA ◽  
Tomoyuki HATAKEYAMA

2007 ◽  
Vol 2007.44 (0) ◽  
pp. 323-324
Author(s):  
Ryoji IMAI ◽  
Yasushi NISHINO ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA

Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa

The natural convection cooling capability in a compact item of electronic equipment was investigated quantitatively by experiment and numerical simulation with a simple channel model. The optimization of the channel sizes, especially the clearance between heated walls, was discussed. The channel model, which consists of a vertical duct of rectangular section, was applied as the experimental model of electronic equipment in this study. The channel model consists of two heated copper walls and two transparent acrylic walls. The clearance between the copper walls of the channel was varied from 5 mm to 15 mm. Temperature measurement on the copper wall surfaces and velocity measurement of natural air flow in the channel by using a particle image velocimetry (PIV) were conducted for a few clearances of the channel. Numerical simulation was also carried out, with a model following the experimental setup, for more detailed discussion of various clearances of the channel. The relationship between the clearance and the temperature rise of the walls or velocity profile was investigated. The correlation between the Rayleigh number and the Nusselt number was obtained from measured temperature. The natural cooling capability and the velocity profiles depend on the clearance between the copper walls. When the wall clearances are more than 15 mm, the cooling is not enhanced. On the other hand, in the case that the clearance becomes less than 7 mm, the cooling capability becomes significantly lower. Consequently, it is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling from the view point of the space and the capability.


Author(s):  
Masaru Ishizuka ◽  
Yoji Kitamura

With rapid increase of the power dissipation density in modern electronic equipment, the cooling design of electronic equipment becomes increasingly important. For widely used forced-convection air-cooled systems, the reliability of and the acoustic noise of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural convection air-cooling is growing to take advantages of low noise and energy saving inherent in that cooling mode. One method of promoting the capacity of natural air-cooling is to incline the electronics casing, thereby, induce draft air by what is called the chimney effect. However, the effect of inclination on the thermal behavior and the cooling capacity has not yet been fully understood due to the involvement of many parameters in driving the draft air. This paper presents the results of experimental and numerical studies on the effect of casing inclination on the temperature rise across the casing. The numerical simulation was carried out to find the thermal behavior inside a thin electronic casing. The simulation results are in good agreement with the experimental data. A thermal design guide is obtained regarding how the cooling effect is improved by increasing the inclination angle.


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