601 A New Measuring Method of Young's Modulus Due to Own-Weight for Thin Flexible Materials

2010 ◽  
Vol 2010.59 (0) ◽  
pp. 337-338
Author(s):  
Atsumi OHTSUKI ◽  
Masatoshi SUZUKI
2012 ◽  
Vol 503 ◽  
pp. 308-311
Author(s):  
Han Chen ◽  
Hua Rong

Large-scale measurement of material property is not suit for the MEMS thin-film. Research the in-situ measuring method for material property of the MEMS thin-film is urgently. A center-anchored circular plate is adopted as the test structure here. The resonance frequency of the circular plate is measured to extract the Young’s modulus of a MEMS thin-film. The accuracy of this non-contact in-situ measuring method has been verified by CoventorWare. The inferences of the stress gradient have been analyzed. The advantages of the test structure and the measuring method present here also have been discussed.


2006 ◽  
Vol 3-4 ◽  
pp. 53-58 ◽  
Author(s):  
Atsumi Ohtsuki

This paper describes a development of a new method (: Cantilever Method) to measure Young’s modulus of flexible materials. The method is based on a nonlinear deformation theory that takes into account large deformation behaviors. A set of testing devices was designed and machined. Measurements were carried out on two kinds of flexible materials (PVC: a high-polymer material and SWPA: a steel material). The modulus measured by this method is “Secant modulus”. The results of my evaluation confirm that the new method is suitable for flexible thin plates or rods. Based on the assessments made the method can be further applied to thin sheet and fiber materials (e.g., steel belt, glass fiber, carbon fiber, optical fiber, etc.).


2000 ◽  
Vol 2000.3 (0) ◽  
pp. 167-168
Author(s):  
Atsumi OHTSUKI ◽  
Hitoshi TAKADA

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