Study on Size-Related Product Quality of Multiscale Central-Punched Cups Fabricated by Compound Forming Directly Using Brass Sheet

Meso/microforming has gained much more attention in the last decades and is widely used as a reliable method to fabricate meso/micro-scaled metallic components. In this research, a compound meso/microforming system which combines deep drawing, punching and blanking operations was developed to fabricate multiscale central-punched cups by using brass sheets. The parts with three scales were produced by using the brass sheets with various thicknesses and grain sizes to investigate geometrical and grain size effects on the deformation behaviors, dimensional accuracy, and material flow behaviors in the forming process. Through physical experiments and finite element simulations, it is revealed that the ultimate deformation load in the drawing-punching stage is smaller than that in the single deep drawing stage under microscale, but the results in the meso-scaled scenarios are opposite. In addition, the thickness variation is increased with grain size, but the variation of the normalized thickness variation does not show an obvious tendency with different size scales. In the bending area, the material flow is tangential to the thickness direction, leading to the formation of thinning area. In addition, the material flow is almost opposite to the punching direction in the punching area, avoiding the expanding deformation of the hole. Thus, the punching operation barely affects the dimensional accuracy including the thickness and hole diameter of the formed parts. Furthermore, the micro-scaled cups with finer grains have a better surface quality. These findings enhance the understanding of size effect in compound meso/microforming with the combined deep drawing and punching operations.

Characterization of the deformation behaviors under uniaxial stress for bicontinuous nanoporous amorphous alloys

The mechanical properties and deformation mechanisms of bicontinuous Cu50Zr50 amorphous alloys are investigated via molecular dynamics simulation.

The Temperature Dependence of Deformation Behaviors in High-Entropy Alloys: A Review

Over the past seventeen years, deformation behaviors of various types of high-entropy alloys (HEAs) have been investigated within a wide temperature range, from cryogenic to high temperatures, to demonstrate the excellent performance of HEAs under extreme conditions. It has been suggested that the dominated deformation mechanisms in HEAs would be varied with respect to the environmental temperatures, which significantly alters the mechanical properties. In this article, we systematically review the temperature-dependent mechanical behaviors, as well as the corresponding mechanisms of various types of HEAs, aiming to provide a comprehensive and up-to-date understanding of the recent progress achieved on this subject. More specifically, we summarize the deformation behaviors and microscale mechanisms of single-phase HEAs, metastable HEAs, precipitates-hardened HEAs and multiphase HEAs, at cryogenic, room and elevated temperatures. The possible strategies for strengthening and toughening HEAs at different temperatures are also discussed to provide new insights for further alloy development.

HOT DEFORMATION BEHAVIOR AND PROCESSING MAP OF A Mg-Gd-Y-Zn-Zr ALLOY

Compression tests of a Mg-13Gd-4Y-2Zn-0.5Zr alloy were carried out on a Gleeble-1500D thermo-mechanical simulator within a temperature range of 420–500 °C and strain rate of 0.001–5 s–1 so that the corresponding flow behavior was investigated. The Zener-Hollomon parameter Z was used in a hyperbolic-sine-type equation to express the relationships between the peak stress, deformation temperature and strain rate. Work hardening, dynamic recovery and dynamic recrystallization were the main characteristics affecting the plastic-deformation behaviors. The activation energy Q was calculated to be 208.2 kJ/mol and processing maps at strains of 0.3, 0.5 and 0.7 were generated based on a dynamic material model. The optimum processing parameters were obtained with a power-dissipation analysis.