Study of a high heat transport Loop Heat Pipe for the automobile thermal management

2018 ◽  
Vol 2018.67 (0) ◽  
pp. 519
Author(s):  
Yoshitada AONO ◽  
Hosei NAGANO ◽  
Seiji YAMASHITA ◽  
Mamoru ISHIKIRIYAMA ◽  
Yu HOSHINO
2021 ◽  
Vol 35 (1) ◽  
pp. 150-158
Author(s):  
Noriyuki WATANABE ◽  
Takuji MIZUTANI ◽  
Masatoshi KAKUE ◽  
Hiroshi NISHIKAWA ◽  
Takahiro TAKADA ◽  
...  

Author(s):  
Sheleen Spencer ◽  
Ronald Sutton ◽  
Robert Baldauff ◽  
Triem Hoang

2020 ◽  
Vol 2020 (0) ◽  
pp. 0093
Author(s):  
Noriyuki Watanabe ◽  
Takuji Mizutani ◽  
Hosei Nagano

Author(s):  
B. P. d’Entremont ◽  
J. M. Ochterbeck

In this investigation, a Loop Heat Pipe (LHP) evaporator has been studied using a borescope inserted through the compensation chamber into the liquid core. This minimally intrusive technique allows liquid/vapor interactions to be observed throughout the liquid core and compensation chamber. A low conductivity ceramic was used for the wick and ammonia as the working fluid. Results indicate that buoyancy driven flows, both two-phase and single-phase, play essential roles in evacuating excess heat from the core, which explains the several differences in performance between horizontal and vertical orientations of the evaporator. This study also found no discernable effect of the pre-start fill level of the compensation chamber on thermal performance during startup at moderate and high heat loads.


Author(s):  
Changwu Xiong ◽  
Lizhan Bai ◽  
Hechao Li ◽  
Yuandong Guo ◽  
Yating Yu ◽  
...  

Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.


2016 ◽  
Vol 2016.54 (0) ◽  
pp. 77-78
Author(s):  
Atsushi TSUJIMORI ◽  
Yoshiya MATSUDA ◽  
Hiroki MATSUOKA ◽  
Sumiko KASHIMA

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