scholarly journals Elastic-Creep Finite Element Analysis of Solder Joints and Experimental Verification Using a Diffused Type Strain Gauge.

1998 ◽  
Vol 64 (619) ◽  
pp. 703-708
Author(s):  
Haruhiko YAMADA ◽  
Kazuyoshi OGAWA ◽  
Yuji YAGI ◽  
Tomohiro SUZUKI
2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung

SIMULATION ◽  
2020 ◽  
Vol 96 (9) ◽  
pp. 713-723
Author(s):  
Rui Zhang ◽  
Dianlei Han ◽  
Guolong Yu ◽  
Haitao Wang ◽  
Haibao Liu ◽  
...  

Inspired by the superior fixed and traction characteristics of ostrich foot toenails, we devised, optimized and manufactured the single structure and group arrangement of a new-style bionic spike for sprint shoes to improve athletic performance. The tractive performance of the bionic spike was tested by finite element analysis and experimental verification. The optimized single structure of the bionic spike had a top slope angle of 13° and the radius of the medial groove of 7.3 mm. Compared with the conventional conic spike, the maximal and stable extrusion resistances of the single bionic spike decreased by about 25% and 40% respectively, while the maximal and stable horizontal thrusts increased by about 16% and 10%, respectively. In addition, the arrangement of the bionic spikes was also optimized. Compared with the conventional spike group, the maximal and stable extrusion resistances of the bionic spike group decreased by 11.0% and 6.2%, respectively, while the maximal and stable horizontal thrusts increased by 20.0% and 16.0%, respectively. The current results may provide useful mechanical information that can help develop a better design of athletic shoes with the potential for advanced performance.


1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.


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