Study on the evolution law of comet-shapeddefects in magnetorheological finishing

2021 ◽  
Author(s):  
Quanlin Shu ◽  
Kuo Hai ◽  
Wen Huang ◽  
Lili Jiang ◽  
Shenghao Yuan ◽  
...  
Keyword(s):  
Magnetorheological Finishing ◽  
Evolution Law

scholarly journals Analysis on affecting factors of magnetorheological finishing

2021 ◽  
Vol 1750 ◽  
pp. 012067
Author(s):  
Lanfang Hao ◽  
Zhongling Liu ◽  
Shixu Li ◽  
Ruiyu Zhu ◽  
Xuli Zhu
Keyword(s):  
Affecting Factors ◽  
Magnetorheological Finishing

scholarly journals A mesh-independent framework for crack tracking in elastodamaging materials through the regularized extended finite element method

2021 ◽  
Author(s):  
Elena Benvenuti ◽  
Nicola Orlando
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Damage Evolution ◽  
Extended Finite Element Method ◽  
Mesh Adaptivity ◽  
Extended Finite Element ◽  
Evolution Law ◽  
Crack Paths ◽  
Original Crack ◽  
Element Method

AbstractWe propose a formulation for tracking general crack paths in elastodamaging materials without mesh adaptivity and broadening of the damage band. The idea is to treat in a unified way both the damaging process and the development of displacement discontinuities by means of the regularized finite element method. With respect to previous authors’ contributions, a novel damage evolution law and an original crack tracking framework are proposed. We face the issue of mesh objectivity through several two-dimensional tests, obtaining smooth crack paths and reliable structural results.

Experimental investigation into polishing of monocrystalline silicon wafer using double-disc chemical assisted magnetorheological finishing process

2021 ◽  
pp. 095440622098384
Author(s):  
Mayank Srivastava ◽  
Pulak M Pandey
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Flow Rate ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Slurry Flow ◽  
Magnetorheological Finishing ◽  
Finishing Process ◽  
Process Factors ◽  
Slurry Flow Rate

In the present work, a novel hybrid finishing process that combines the two preferred methods in industries, namely, chemical-mechanical polishing (CMP) and magneto-rheological finishing (MRF), has been used to polish monocrystalline silicon wafers. The experiments were carried out on an indigenously developed double-disc chemical assisted magnetorheological finishing (DDCAMRF) experimental setup. The central composite design (CCD) was used to plan the experiments in order to estimate the effect of various process factors, namely polishing speed, slurry flow rate, percentage CIP concentration, and working gap on the surface roughness ([Formula: see text]) by DDCAMRF process. The analysis of variance was carried out to determine and analyze the contribution of significant factors affecting the surface roughness of polished silicon wafer. The statistical investigation revealed that percentage CIP concentration with a contribution of 30.6% has the maximum influence on the process performance followed by working gap (21.4%), slurry flow rate (14.4%), and polishing speed (1.65%). The surface roughness of polished silicon wafers was measured by the 3 D optical profilometer. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were carried out to understand the surface morphology of polished silicon wafer. It was found that the surface roughness of silicon wafer improved with the increase in polishing speed and slurry flow rate, whereas it was deteriorated with the increase in percentage CIP concentration and working gap.

Evolution law of a negative binomial state in an amplitude dissipative channel

2014 ◽  
Vol 23 (3) ◽  
pp. 030304 ◽  
Author(s):  
Feng Chen ◽  
Hong-Yi Fan
Keyword(s):  
Negative Binomial ◽  
Evolution Law ◽  
Binomial State

Anti-Evolution Law Tested

1966 ◽  
Vol 89 (1) ◽  
pp. 7 ◽  
Author(s):  
Jerry Tompkins
Keyword(s):  
Evolution Law
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