Abstract
Development of MEMS inertial sensor packages for high performance applications cannot be accomplished by analysis alone. There are too many unknown material properties, process conditions, and assembly tolerances to make this feasible. Extensive performance evaluation of packaged sensors is also prohibitively expensive and time consuming. However, recent advances in the ACES methodology of micro-interferometric measurements coupled with analytical and computational analysis offer a considerable promise for effective optimization of the design of advanced sensor packages. Sub-micron displacements of sensors can be readily measured with nanometer accuracy over a range of environmental conditions. This greatly facilitates the validation and refinement of quantitative models of packages and complex material structures. This paper describes the new approach, based on optoelectronic laser interferometric microscope methodology, to development of packaging for MEMS inertial sensors and discusses preliminary results that have been obtained.
Computational analysis of novel high performance optically controlled RF switches for reconfigurable millimeterwave-to-THz circuits
